JPS62201928U - - Google Patents

Info

Publication number
JPS62201928U
JPS62201928U JP9015186U JP9015186U JPS62201928U JP S62201928 U JPS62201928 U JP S62201928U JP 9015186 U JP9015186 U JP 9015186U JP 9015186 U JP9015186 U JP 9015186U JP S62201928 U JPS62201928 U JP S62201928U
Authority
JP
Japan
Prior art keywords
support groove
supporting
boat
quartz
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9015186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9015186U priority Critical patent/JPS62201928U/ja
Publication of JPS62201928U publication Critical patent/JPS62201928U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案のウエーハ支持用石英ボ
ートの一部拡大断面図を、第２図、第３図は本考
案の他の例の一部拡大断面図を、第４図、第５図
、第６図、第７図は従来のウエーハ支持用石英ボ
ートの一部拡大断面図を示す。 １…支持溝、２…ウエーハ、３…縁、４…底部
。 1a and 1b are partially enlarged sectional views of a quartz boat for supporting wafers according to the present invention, FIGS. 2 and 3 are partially enlarged sectional views of other examples of the present invention, and FIGS. 5, 6, and 7 show partially enlarged sectional views of conventional wafer supporting quartz boats. 1...Support groove, 2...Wafer, 3...Edge, 4...Bottom.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエーハを嵌合支持するための実質的に
垂直方向に穿設した支持溝をもつ石英ガラス製ボ
ートにおいて、該支持溝の底部が水平に対して５
〜３０°傾斜していることを特徴とするウエーハ
支持用石英ボート。 In a quartz glass boat having a support groove cut in a substantially vertical direction for fitting and supporting a semiconductor wafer, the bottom of the support groove is 5 mm from the horizontal.
A quartz boat for supporting wafers characterized by an inclination of ~30°.
JP9015186U 1986-06-13 1986-06-13 Pending JPS62201928U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9015186U JPS62201928U (en) 1986-06-13 1986-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9015186U JPS62201928U (en) 1986-06-13 1986-06-13

Publications (1)

Publication Number Publication Date
JPS62201928U true JPS62201928U (en) 1987-12-23

Family

ID=30949755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9015186U Pending JPS62201928U (en) 1986-06-13 1986-06-13

Country Status (1)

Country Link
JP (1) JPS62201928U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233427U (en) * 1988-08-26 1990-03-02
JP2021097094A (en) * 2019-12-16 2021-06-24 株式会社Sumco Method of manufacturing soi wafer, and boat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516664A (en) * 1974-07-05 1976-01-20 Hitachi Ltd ITAJOBUTSUSHIJIJIGU
JPS57167625A (en) * 1980-11-24 1982-10-15 Ee Esu Kiyuu Bootsu Inc Quartz boat for machining semiconductor wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516664A (en) * 1974-07-05 1976-01-20 Hitachi Ltd ITAJOBUTSUSHIJIJIGU
JPS57167625A (en) * 1980-11-24 1982-10-15 Ee Esu Kiyuu Bootsu Inc Quartz boat for machining semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233427U (en) * 1988-08-26 1990-03-02
JP2021097094A (en) * 2019-12-16 2021-06-24 株式会社Sumco Method of manufacturing soi wafer, and boat

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