JPS6430825U - - Google Patents
Info
- Publication number
- JPS6430825U JPS6430825U JP12585987U JP12585987U JPS6430825U JP S6430825 U JPS6430825 U JP S6430825U JP 12585987 U JP12585987 U JP 12585987U JP 12585987 U JP12585987 U JP 12585987U JP S6430825 U JPS6430825 U JP S6430825U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pair
- supports
- groove
- boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 11
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は本考案の一実施例の正面図、第２図及
び第３図は一実施例の部分拡大側面図である。第
４図及び第５図は本考案の一従来例の夫々斜視図
及び正面図、第６図は一従来例の部分拡大側面図
である。
なお図面に用いた符号において、１１，１２…
…ウエハ支持体、１３……ウエハ、１５……ウエ
ハ支持体、１６，１７……溝、１７ｂ……底面、
である。
FIG. 1 is a front view of an embodiment of the present invention, and FIGS. 2 and 3 are partially enlarged side views of the embodiment. 4 and 5 are a perspective view and a front view, respectively, of a conventional example of the present invention, and FIG. 6 is a partially enlarged side view of a conventional example. In addition, in the symbols used in the drawings, 11, 12...
...Wafer support, 13...Wafer, 15...Wafer support, 16, 17...Groove, 17b...Bottom surface,
It is.
Claims (1)
形成されている上側及び下側の一対ずつのウエハ
支持体を有するウエハボートにおいて、 前記ウエハとの当接面が前記下側の一対のウエ
ハ支持体における前記溝の底面よりも前記ウエハ
に近接する様に配されている一対のウエハ支持体
を更に具備することを特徴とするウエハボート。 ２ 前記下側の一対のウエハ支持体における前記
溝の幅が前記上側の一対のウエハ支持体における
前記溝の幅よりも広いことを特徴とする実用新案
登録請求の範囲第１項に記載のウエハボート。[Claims for Utility Model Registration] 1. A wafer boat having a pair of upper and lower wafer supports each having a groove into which the peripheral edge of the wafer is inserted, the contact surface with the wafer; The wafer boat further comprises a pair of wafer supports arranged closer to the wafers than the bottom surfaces of the grooves in the lower pair of wafer supports. 2. The wafer according to claim 1, wherein the width of the groove in the lower pair of wafer supports is wider than the width of the groove in the upper pair of wafer supports. boat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12585987U JPS6430825U (en) | 1987-08-19 | 1987-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12585987U JPS6430825U (en) | 1987-08-19 | 1987-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430825U true JPS6430825U (en) | 1989-02-27 |
Family
ID=31376836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12585987U Pending JPS6430825U (en) | 1987-08-19 | 1987-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430825U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141221A (en) * | 2008-12-15 | 2010-06-24 | Shin-Etsu Chemical Co Ltd | Method of manufacturing silicon substrate with oxide film |
-
1987
- 1987-08-19 JP JP12585987U patent/JPS6430825U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141221A (en) * | 2008-12-15 | 2010-06-24 | Shin-Etsu Chemical Co Ltd | Method of manufacturing silicon substrate with oxide film |