JPH023302B2 - - Google Patents
Info
- Publication number
- JPH023302B2 JPH023302B2 JP60120366A JP12036685A JPH023302B2 JP H023302 B2 JPH023302 B2 JP H023302B2 JP 60120366 A JP60120366 A JP 60120366A JP 12036685 A JP12036685 A JP 12036685A JP H023302 B2 JPH023302 B2 JP H023302B2
- Authority
- JP
- Japan
- Prior art keywords
- movable beam
- film
- semiconductor device
- substrate
- polysilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60120366A JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60120366A JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58163270A Division JPS6055655A (ja) | 1983-09-07 | 1983-09-07 | 梁構造体を有する半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61105861A JPS61105861A (ja) | 1986-05-23 |
| JPH023302B2 true JPH023302B2 (enrdf_load_stackoverflow) | 1990-01-23 |
Family
ID=14784416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60120366A Granted JPS61105861A (ja) | 1985-06-05 | 1985-06-05 | 梁構造体を有する半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61105861A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19961299B4 (de) * | 1999-12-18 | 2009-04-30 | Robert Bosch Gmbh | Sensor zur Erkennung des Klopfens bei einer Brennkraftmaschine |
| DK1469701T3 (da) * | 2000-08-11 | 2008-08-18 | Knowles Electronics Llc | Ophöjede mikrostrukturer |
-
1985
- 1985-06-05 JP JP60120366A patent/JPS61105861A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61105861A (ja) | 1986-05-23 |
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