JPH0232112B2 - - Google Patents

Info

Publication number
JPH0232112B2
JPH0232112B2 JP61240767A JP24076786A JPH0232112B2 JP H0232112 B2 JPH0232112 B2 JP H0232112B2 JP 61240767 A JP61240767 A JP 61240767A JP 24076786 A JP24076786 A JP 24076786A JP H0232112 B2 JPH0232112 B2 JP H0232112B2
Authority
JP
Japan
Prior art keywords
holder
wafer
recess
holding
polishing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61240767A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6393562A (ja
Inventor
Hajime Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RODEERU NITSUTA KK
Original Assignee
RODEERU NITSUTA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RODEERU NITSUTA KK filed Critical RODEERU NITSUTA KK
Priority to JP61240767A priority Critical patent/JPS6393562A/ja
Publication of JPS6393562A publication Critical patent/JPS6393562A/ja
Publication of JPH0232112B2 publication Critical patent/JPH0232112B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP61240767A 1986-10-09 1986-10-09 ウェハの保持方法及びその装置 Granted JPS6393562A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61240767A JPS6393562A (ja) 1986-10-09 1986-10-09 ウェハの保持方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61240767A JPS6393562A (ja) 1986-10-09 1986-10-09 ウェハの保持方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6393562A JPS6393562A (ja) 1988-04-23
JPH0232112B2 true JPH0232112B2 (en:Method) 1990-07-18

Family

ID=17064406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61240767A Granted JPS6393562A (ja) 1986-10-09 1986-10-09 ウェハの保持方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6393562A (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289657A (ja) * 1988-05-13 1989-11-21 Matsushita Electric Ind Co Ltd 研摩定盤および研摩方法
JP2003060014A (ja) * 2001-08-17 2003-02-28 Disco Abrasive Syst Ltd 板状被加工物のための保持具
KR101174925B1 (ko) 2005-08-31 2012-08-17 신에쓰 가가꾸 고교 가부시끼가이샤 웨이퍼의 연마 방법 및 연마된 웨이퍼

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60135174A (ja) * 1983-12-23 1985-07-18 Toppan Printing Co Ltd 裏面研磨方法

Also Published As

Publication number Publication date
JPS6393562A (ja) 1988-04-23

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