JPH0231857B2 - - Google Patents
Info
- Publication number
- JPH0231857B2 JPH0231857B2 JP61138276A JP13827686A JPH0231857B2 JP H0231857 B2 JPH0231857 B2 JP H0231857B2 JP 61138276 A JP61138276 A JP 61138276A JP 13827686 A JP13827686 A JP 13827686A JP H0231857 B2 JPH0231857 B2 JP H0231857B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- photoresist
- heat resistance
- processing table
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 49
- 238000003672 processing method Methods 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 239000002344 surface layer Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61138276A JPS62295418A (ja) | 1986-06-16 | 1986-06-16 | レジスト処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61138276A JPS62295418A (ja) | 1986-06-16 | 1986-06-16 | レジスト処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62295418A JPS62295418A (ja) | 1987-12-22 |
JPH0231857B2 true JPH0231857B2 (de) | 1990-07-17 |
Family
ID=15218130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61138276A Granted JPS62295418A (ja) | 1986-06-16 | 1986-06-16 | レジスト処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62295418A (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6225601B1 (en) * | 1998-07-13 | 2001-05-01 | Applied Komatsu Technology, Inc. | Heating a substrate support in a substrate handling chamber |
CN100424822C (zh) * | 2003-06-06 | 2008-10-08 | 东京毅力科创株式会社 | 基板的处理膜表面粗糙度的改善方法及基板的处理装置 |
-
1986
- 1986-06-16 JP JP61138276A patent/JPS62295418A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62295418A (ja) | 1987-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |