JPH0231500B2 - - Google Patents

Info

Publication number
JPH0231500B2
JPH0231500B2 JP59031959A JP3195984A JPH0231500B2 JP H0231500 B2 JPH0231500 B2 JP H0231500B2 JP 59031959 A JP59031959 A JP 59031959A JP 3195984 A JP3195984 A JP 3195984A JP H0231500 B2 JPH0231500 B2 JP H0231500B2
Authority
JP
Japan
Prior art keywords
properties
semiconductor
stamping
alloy
lead material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59031959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60176258A (ja
Inventor
Rensei Futatsuka
Shunichi Chiba
Tadao Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP59031959A priority Critical patent/JPS60176258A/ja
Publication of JPS60176258A publication Critical patent/JPS60176258A/ja
Publication of JPH0231500B2 publication Critical patent/JPH0231500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP59031959A 1984-02-22 1984-02-22 半導体用リ−ド材 Granted JPS60176258A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59031959A JPS60176258A (ja) 1984-02-22 1984-02-22 半導体用リ−ド材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59031959A JPS60176258A (ja) 1984-02-22 1984-02-22 半導体用リ−ド材

Publications (2)

Publication Number Publication Date
JPS60176258A JPS60176258A (ja) 1985-09-10
JPH0231500B2 true JPH0231500B2 (show.php) 1990-07-13

Family

ID=12345494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59031959A Granted JPS60176258A (ja) 1984-02-22 1984-02-22 半導体用リ−ド材

Country Status (1)

Country Link
JP (1) JPS60176258A (show.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164835A (ja) * 1984-09-04 1986-04-03 Nippon Mining Co Ltd 耐熱高力高導電性銅合金
JP2501636B2 (ja) * 1989-02-10 1996-05-29 三菱伸銅株式会社 スタンピング金型の摩耗抑制効果にすぐれた半導体装置のリ―ドフレ―ム用Ｃｕ合金素材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481121A (en) * 1977-12-13 1979-06-28 Sumitomo Electric Ind Ltd Process for refining electroconductive copper
JPS5841779B2 (ja) * 1978-03-23 1983-09-14 玉川機械金属株式会社 半導体用リ−ド材

Also Published As

Publication number Publication date
JPS60176258A (ja) 1985-09-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term