JPH0230871Y2 - - Google Patents
Info
- Publication number
- JPH0230871Y2 JPH0230871Y2 JP1984134693U JP13469384U JPH0230871Y2 JP H0230871 Y2 JPH0230871 Y2 JP H0230871Y2 JP 1984134693 U JP1984134693 U JP 1984134693U JP 13469384 U JP13469384 U JP 13469384U JP H0230871 Y2 JPH0230871 Y2 JP H0230871Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- partition plate
- base member
- frame base
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005192 partition Methods 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000005476 soldering Methods 0.000 description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984134693U JPH0230871Y2 (pt) | 1984-09-04 | 1984-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984134693U JPH0230871Y2 (pt) | 1984-09-04 | 1984-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6149495U JPS6149495U (pt) | 1986-04-03 |
| JPH0230871Y2 true JPH0230871Y2 (pt) | 1990-08-20 |
Family
ID=30693198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984134693U Expired JPH0230871Y2 (pt) | 1984-09-04 | 1984-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230871Y2 (pt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2540985Y2 (ja) * | 1992-07-13 | 1997-07-09 | アルプス電気株式会社 | 枠取付構造 |
| CN220233161U (zh) * | 2021-01-15 | 2023-12-22 | 株式会社村田制作所 | 模块 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419601B2 (pt) * | 1975-03-24 | 1979-07-17 | ||
| JPS5512480U (pt) * | 1978-07-13 | 1980-01-26 | ||
| JPS5844899B2 (ja) * | 1975-11-28 | 1983-10-06 | 株式会社クボタ | ヘンソクソウチ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419601U (pt) * | 1977-07-08 | 1979-02-08 | ||
| JPS5582000U (pt) * | 1978-11-30 | 1980-06-05 | ||
| JPS5844899U (ja) * | 1981-09-18 | 1983-03-25 | 日本電気ホームエレクトロニクス株式会社 | シ−ルド板取付構体 |
-
1984
- 1984-09-04 JP JP1984134693U patent/JPH0230871Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5419601B2 (pt) * | 1975-03-24 | 1979-07-17 | ||
| JPS5844899B2 (ja) * | 1975-11-28 | 1983-10-06 | 株式会社クボタ | ヘンソクソウチ |
| JPS5512480U (pt) * | 1978-07-13 | 1980-01-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6149495U (pt) | 1986-04-03 |
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