JPH0230871Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial field of application This invention is applicable to shielding partition structures for high frequency equipment, especially for shielding partition plates for printed wiring bodies in high frequency circuit devices such as television tuners, and for other shielding partition plates or chassis bases. The present invention relates to a shield partition structure suitable for a solder connection structure.

2. Description of the Related Art A high frequency circuit device such as a television tuner is usually constructed by housing a printed wiring body in a shield case made of a frame base member. Here, after the wiring body is housed in a case, the shield partition plates included in the wiring body and the shield partition plates and the shield case are electrically and mechanically coupled by solder. For example, as shown in FIG. 5, this type of high-frequency circuit device is constructed by arranging two shielding partition plates 2 and 3 in a T-shape on a printed circuit board 1 together with predetermined circuit components (not shown). A printed wiring body 4 is formed by soldering, and this printed wiring body 4 is housed in a frame base member 5 made of metal plates on four sides. The housed printed wiring body is fixed by soldering between the printed circuit board 1 and the frame base member 5, and also between the shielding partition plates 2 and 3 and between the partition plate and the frame base member 5 by solder 6. Functions will be achieved effectively.

Problems that the invention aims to solve: However, when soldering shield partition plates that stand upright to other partition plates or shield base members, the soldering iron does not fit into the corners because the walls are perpendicular to each other. Proper soldering is extremely difficult, and solder defects are likely to occur due to excess or deficiency of solder. In particular, it is difficult to supply solder 6 at orthogonal positions as shown in FIG. 5, and the solder tends to be in excess, which may affect the high frequency characteristics.

As a countermeasure against this, it has been proposed, for example, to prepare a shielding partition plate 7 as shown in FIG. 6, provide a protrusion 8 on its upper side, and fold this protrusion 8 to facilitate solder supply. Ru. However, in this case, although the soldering work would be easier, it would be difficult to construct the part mold for the partition plate 7, material removal would be difficult, and the unit price of the partition plate would be high, resulting in economical problems.

Therefore, the present invention has been proposed in view of the above-mentioned deficiencies, and its object is to provide a new and improved shield partition structure for high frequency equipment.

Means for Solving the Problems According to the present invention, the shield partition plate constituting the shield partition structure is provided with an obliquely bent piece at the upper end thereof. This bent piece is used for soldering to another shielding partition plate arranged orthogonally to the plane of the shielding case, and the printed wiring body including the partitioning plate is housed in the frame base member. In a high frequency assembly device, molten solder is supplied onto this bent piece to electrically and mechanically connect the two sealing members. Here, in order to maintain an appropriate solder flow and amount of solder, the angle of inclination of the bent piece is selected to be within 45 degrees, preferably about 20 degrees, and the unfolded state of the partition plate is set at a right angle. Sheet metal members are used.

Effects According to the configuration of the present invention, since the folded piece does not protrude in the unfolded state, the mold can be simplified and the sheet metal member can be used effectively. In particular, the slanted bent piece facilitates the supply of solder to the soldering iron and can appropriately guide molten solder to a desired position. In addition, by regulating the bending angle of the inclined bent piece, the amount of solder can be optimized and stable assembly can be achieved.

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an exploded perspective view of the shield partition structure of the present invention, which includes a printed wiring body 14 in which shield partition plates 12 and 13 are arranged in a T-shape at predetermined positions on a printed circuit board 11, and a printed wiring body 14 that accommodates this wiring body 14. This is a high frequency assembly device composed of a frame base member 15 and a frame base member 15, for example, an electronic tuner for a television, in which a printed wiring body 14 is equipped with a large number of tuner circuit parts (not shown) in addition to partition plates 12 and 13. be done. Further, the frame base member 15 has a group of input/output terminals attached to the side wall surface at appropriate positions, and is used for internal and external connections with the wiring body housed therein. In addition,
Shield covers (not shown) are attached to both openings of the frame base member 15.

In such a high frequency assembly apparatus, the shielding partition plates 12 and 13 are provided with an inclined bent piece 16 at the upper end thereof. This bent piece 16 is a feature of the present invention, and allows the shielding partition plate 12 to be placed on the plane of the other partitioning plate 13, and the shielding partition plate 12, 1
3 to the plane of the frame base member 15 by soldering.

2 and 3 show the solder connection between the shielding partition plate 12 and the frame base member 15 when the printed wiring body 14 is housed in the frame base member 15. FIG. First, as shown in FIG.
The soldering iron 20 is placed in a state in which one end surface of the soldering iron 20 is accommodated in the frame base member 15 and placed in contact with the frame base member 15.
is applied to the bent piece 16, and filamentous solder 21 is supplied thereto to form molten solder. This molten solder flows in the direction shown by the arrow in FIG. 3 to achieve bonding of the solder 22 to the desired corner portion. The amount of solder supplied at the same time can be regulated by the dimensions of the bent piece 16 to ensure proper solder bonding. Therefore, soldering by an automatic soldering device using a robot becomes easy, which helps improve the reliability of soldering.

FIG. 4 is a plan view of the main parts of the partition plates 12 and 13 for sheet metal processing according to the present invention. In the manufacturing process, the metal plate 17 is cut with mounting legs 18 provided on its lower side. Although this metal plate 17 is bent at its upper side corner portion 19, it is characterized in that no protrusion is provided on the upper side, thereby simplifying the mold for sheet metal processing and facilitating material removal. Here, in the specific example of the present invention, it has been confirmed that the angle θ with respect to the upper side of the corner portion 19 prepared for forming the inclined bent piece 16 is regulated within 45° to achieve proper soldering. Preferably, it is about 20%, with dimensions a being 2 mm and b being 5 mm.

The shield partition plates 12 and 13, which are sheet-metal processed under these conditions, have an inclined bent piece 16 at the upper end, so that the contact area of the soldering iron is concentrated on almost one point so that the preheating time during the soldering process is shortened. can. Reducing the preheating time, including regulating the amount of solder to be supplied, ensures and facilitates the flow of solder to a desired position and is useful for reliable soldering. Note that cream solder may be used as the solder material and soldered by heating.

Effects of the invention Utilization of the bent piece of the invention makes solder connection easy and reliable. In particular, reliability is improved because the solder melted by heating moves along the bent piece to the desired soldering area. In addition, the simplification of molds for sheet metal processing and the improvement in the utilization rate of material removal are useful for reducing the cost of partition plates, which has a large practical effect.

[Brief explanation of drawings]

Figure 1 is an exploded perspective view of the shield partition structure of the present invention, Figure 2 is an enlarged sectional view of the main parts of Figure 1 after assembly,
Figure 3 is a plan view after soldering in Figure 2, Figure 4 is a plan view of the main part of the metal plate that makes up the partition plate in Figure 1, and Figure 5
The figure is an exploded perspective view of a conventional shield partition structure, and FIG. 6 is an enlarged plan view of a main part showing a modification of the partition plate of FIG. 5. 11... Printed circuit board, 12, 13... Shield partition plate, 14... Printed wiring body, 15...
Frame base member, 16...Bending piece, 22...
solder.

Claims (1)

[Claims for Utility Model Registration] A high-frequency assembly device comprising a printed wiring body in which a shielding partition plate is arranged at a predetermined position of a printed circuit board, and a frame base member that accommodates this printed wiring body, wherein the shielding partition plate is A slanted bent piece formed at an angle of 45° or less with respect to the upper side is provided at the upper end, and molten solder supplied to this bent piece allows the shielding partition plate to be connected to another shielding partition plate. Alternatively, a shield partition structure characterized in that the shield partition structure is soldered to a flat portion of the frame base member.