JPH0230173B2 - - Google Patents
Info
- Publication number
- JPH0230173B2 JPH0230173B2 JP61116652A JP11665286A JPH0230173B2 JP H0230173 B2 JPH0230173 B2 JP H0230173B2 JP 61116652 A JP61116652 A JP 61116652A JP 11665286 A JP11665286 A JP 11665286A JP H0230173 B2 JPH0230173 B2 JP H0230173B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- pattern
- layer
- patterns
- vernier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 41
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 12
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61116652A JPS62273724A (ja) | 1986-05-21 | 1986-05-21 | マスク合わせ精度評価用バ−ニアパタ−ン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61116652A JPS62273724A (ja) | 1986-05-21 | 1986-05-21 | マスク合わせ精度評価用バ−ニアパタ−ン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62273724A JPS62273724A (ja) | 1987-11-27 |
| JPH0230173B2 true JPH0230173B2 (ko) | 1990-07-04 |
Family
ID=14692533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61116652A Granted JPS62273724A (ja) | 1986-05-21 | 1986-05-21 | マスク合わせ精度評価用バ−ニアパタ−ン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62273724A (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2666859B2 (ja) * | 1988-11-25 | 1997-10-22 | 日本電気株式会社 | 目合せ用バーニヤパターンを備えた半導体装置 |
| JP2790416B2 (ja) * | 1993-08-26 | 1998-08-27 | 沖電気工業株式会社 | アライメントマーク配置方法 |
| CN106981435B (zh) * | 2016-01-15 | 2019-12-03 | 无锡华润上华科技有限公司 | 一种光刻检查图形结构 |
-
1986
- 1986-05-21 JP JP61116652A patent/JPS62273724A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62273724A (ja) | 1987-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |