JPH0229721Y2 - - Google Patents
Info
- Publication number
- JPH0229721Y2 JPH0229721Y2 JP1984017229U JP1722984U JPH0229721Y2 JP H0229721 Y2 JPH0229721 Y2 JP H0229721Y2 JP 1984017229 U JP1984017229 U JP 1984017229U JP 1722984 U JP1722984 U JP 1722984U JP H0229721 Y2 JPH0229721 Y2 JP H0229721Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- fixed blade
- guide
- blade
- clamp rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 73
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1722984U JPS60130637U (ja) | 1984-02-09 | 1984-02-09 | ソルダ−供給ユニツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1722984U JPS60130637U (ja) | 1984-02-09 | 1984-02-09 | ソルダ−供給ユニツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60130637U JPS60130637U (ja) | 1985-09-02 |
| JPH0229721Y2 true JPH0229721Y2 (US20090163788A1-20090625-C00002.png) | 1990-08-09 |
Family
ID=30504736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1722984U Granted JPS60130637U (ja) | 1984-02-09 | 1984-02-09 | ソルダ−供給ユニツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130637U (US20090163788A1-20090625-C00002.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868943A (ja) * | 1981-10-20 | 1983-04-25 | Mitsubishi Electric Corp | ダイボンデイング用ろう材供給装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157561U (US20090163788A1-20090625-C00002.png) * | 1978-04-21 | 1979-11-01 |
-
1984
- 1984-02-09 JP JP1722984U patent/JPS60130637U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868943A (ja) * | 1981-10-20 | 1983-04-25 | Mitsubishi Electric Corp | ダイボンデイング用ろう材供給装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60130637U (ja) | 1985-09-02 |
