JPH02278741A - Resin-sealing mold - Google Patents
Resin-sealing moldInfo
- Publication number
- JPH02278741A JPH02278741A JP10041989A JP10041989A JPH02278741A JP H02278741 A JPH02278741 A JP H02278741A JP 10041989 A JP10041989 A JP 10041989A JP 10041989 A JP10041989 A JP 10041989A JP H02278741 A JPH02278741 A JP H02278741A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- ejector
- groove
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 5
- 238000013022 venting Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の外郭を樹脂封止する樹脂封止金型
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin sealing mold for sealing the outer shell of a semiconductor device with resin.
従来、半導体装置、特に、樹脂封止型半導体装置の外郭
体を製作する場合は、上下の金型に、リードフレームの
アイランドに搭載された半導体チップの外郭を覆う窪み
を形成し、この窪みに半導体チップを入れ、溶融樹脂を
流し込み固めて製作していた。Conventionally, when manufacturing the outer shell of a semiconductor device, especially a resin-sealed semiconductor device, a depression is formed in the upper and lower molds to cover the outer shell of the semiconductor chip mounted on the island of the lead frame. It was manufactured by inserting a semiconductor chip and pouring molten resin to harden it.
第４図は従来の樹脂封止金型の一例を示す断面図である
。従来、この種の樹脂封止金型は、同図に示すように、
リードフレーム３のアイランド３ａに搭載された半導体
チップ６の外郭を覆う窪み８ａ及び８ｂが上型１及び下
型２の型面に形成され、この窪み８ａ及び８ｂの周囲の
型面には、空気抜けの溝４が形成されていた。FIG. 4 is a sectional view showing an example of a conventional resin-sealed mold. Conventionally, this type of resin-sealed mold has been used as shown in the figure.
Recesses 8a and 8b that cover the outer contour of the semiconductor chip 6 mounted on the island 3a of the lead frame 3 are formed on the mold surfaces of the upper mold 1 and the lower mold 2, and the mold surfaces around the recesses 8a and 8b are filled with air. A clearance groove 4 was formed.
この金型により半導体装置を樹脂封止する場合は、リー
ドフレーム３のアイランド３ａに搭載された半導体チッ
プ６を金型の窪み８ａ及び８ｂの中に入れて、型閉めを
行なった後に、溶融樹脂７を流し込み樹脂封止する。こ
のとき、窪み８ａ及び８ｂに停留している空気は、溶融
樹脂７に押し出され溝４を抜は金型外に排出される。When a semiconductor device is resin-sealed using this mold, the semiconductor chip 6 mounted on the island 3a of the lead frame 3 is placed into the depressions 8a and 8b of the mold, and after the mold is closed, the molten resin is sealed. Pour 7 and seal with resin. At this time, the air remaining in the depressions 8a and 8b is pushed out by the molten resin 7 and is discharged through the groove 4 and out of the mold.
しかしながら、上述した従来の樹脂封止金型では、樹脂
封止を繰返して行なっているうちに、空気抜は用の溝に
樹脂が付着する。従って、この樹脂を除去するために金
型を清掃しなければならない。また、この清掃作業が多
くの工数を費やすという欠点がある。さらに、この清掃
作業を怠ると、この空気抜けの溝が塞がり、樹脂封止さ
れた半導体装置の樹脂体に気泡とか、欠損を生じ、品質
上の重大な問題を引き起すことがある。However, in the conventional resin sealing mold described above, as resin sealing is repeatedly performed, resin adheres to the air vent groove. Therefore, the mold must be cleaned to remove this resin. Another drawback is that this cleaning work requires a lot of man-hours. Furthermore, if this cleaning work is neglected, this air vent groove may become clogged, causing bubbles or defects in the resin body of the resin-sealed semiconductor device, causing serious quality problems.
本発明の目的は、清掃作業をすることがないとともに半
導体装置の樹脂体に気泡及び欠損を生ずることのない樹
脂封止金型を提供することである。An object of the present invention is to provide a resin sealing mold that does not require cleaning work and does not cause bubbles or defects in the resin body of a semiconductor device.
本発明の樹脂封止金型は、リードフレームのアイランド
に搭載された半導体チップの外郭を覆う窪みが型面に形
成されるとともにこの窪みの周囲に空気抜けの溝が形成
される半導体装置用樹脂封止金型において、前記空気抜
けの溝より突出したり引込んだりするエジェクタを備え
構成される。The resin sealing mold of the present invention is a resin for semiconductor devices in which a recess is formed on the mold surface to cover the outer shell of a semiconductor chip mounted on an island of a lead frame, and an air vent groove is formed around the recess. The sealing mold includes an ejector that protrudes from or retracts from the air vent groove.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明による一実施例を示す樹脂封止金型を型
閉めしたときの部分断面図、第２図は型開きしたときの
第１図に示す樹脂封止金型の部分断面図、第３図は他の
実施例を示す樹脂封止金型の型面の部分平面図である。FIG. 1 is a partial cross-sectional view of a resin-sealed mold showing an embodiment of the present invention when the mold is closed, and FIG. 2 is a partial cross-sectional view of the resin-sealed mold shown in FIG. 1 when the mold is opened. , FIG. 3 is a partial plan view of the mold surface of a resin-sealed mold showing another embodiment.
この樹脂封止金型は、第１図及び第２図に示すように、
上型１及び下型２の窪みの周囲の型面に？ｇ４ａにはめ
込まれたエジェクタ５を設けたことである。それ以外は
従来と同じである。As shown in FIGS. 1 and 2, this resin-sealed mold is
On the mold surface around the depressions of upper mold 1 and lower mold 2? This is because the ejector 5 is fitted into the g4a. Other than that, it is the same as before.
このエジェクタ５を設けることにより、型閉めのときは
、第１図に示すように、溝４ａにはめ込まれたエジェク
タ５は型面より引込み、空隙９を形成する。この空隙９
が樹脂封止するときの空気抜きになる。また、型開きの
ときは、第２図に示すように、エジェクタ５が型面より
突出し、溝４ａに付着した樹脂を除去する。By providing this ejector 5, when the mold is closed, the ejector 5 fitted into the groove 4a is retracted from the mold surface to form a gap 9, as shown in FIG. This void 9
This serves as an air vent when sealing with resin. Furthermore, when the mold is opened, as shown in FIG. 2, the ejector 5 protrudes from the mold surface and removes the resin adhered to the grooves 4a.
また、このエジェクタ５は、溝４ａの長手方向に一杯の
長さをもつ必要がなく、例えば、第３図に示すように、
溝４ａの長さの一部の長さをもつエジェクタ５ａでも良
い。さらに、このエジェクタの形状は、例えば、円形の
ピンでも差しつかえない。Moreover, this ejector 5 does not need to have a full length in the longitudinal direction of the groove 4a, for example, as shown in FIG.
The ejector 5a may have a length that is part of the length of the groove 4a. Furthermore, the shape of this ejector may be, for example, a circular pin.
このように、樹脂封止金型の溝にはめ込むエジェクタを
設けることにより、溝に付着する樹脂を取り除くことが
出来るようになった。In this way, by providing an ejector that fits into the groove of the resin sealing mold, it has become possible to remove the resin adhering to the groove.
以上説明したように本発明は、型面に空気抜は用の溝に
突き出たり、引込んだりするエジェクタを設けることに
より、樹脂封止毎に付着する樹脂を除去することが出来
るので、清掃作業を必要とせず、樹脂体に気泡や、欠損
を生ずることのない樹脂封止金型が得られるという効果
がある。As explained above, in the present invention, by providing an ejector on the mold surface that protrudes or retracts into the air vent groove, the resin that adheres to each resin seal can be removed, making it possible to remove the resin that adheres to the mold surface. This method has the effect of providing a resin-sealed mold that does not require any bubbles or defects in the resin body.
開きしたときの第１図に示す樹脂封止金型の部分断面図
、第３図は他の実施例を示す樹脂封止金型の型面の部分
平面図、第４図は従来の樹脂封止金型の一例を示す断面
図である。FIG. 1 is a partial cross-sectional view of the resin sealing mold shown in FIG. 1 when opened, FIG. 3 is a partial plan view of the mold surface of the resin sealing mold showing another embodiment, and FIG. 4 is a conventional resin sealing mold. It is a sectional view showing an example of a stopper die.
１・・・上型、２・・・下型、３・・・リードフレーム
、４．４ａ・・・溝、５．５ａ・・・エジェクタ、６・
・・半導体チップ、７・・・溶融樹脂、８．８ａ、８ｂ
・・・窪み、９・・・空隙。DESCRIPTION OF SYMBOLS 1... Upper die, 2... Lower die, 3... Lead frame, 4.4a... Groove, 5.5a... Ejector, 6...
... Semiconductor chip, 7... Molten resin, 8.8a, 8b
... depression, 9... void.
Claims (1)
の外郭を覆う窪みが型面に形成されるとともにこの窪み
の周囲に空気抜けの溝が形成されている樹脂封止金型に
おいて、前記空気抜けの溝より突出したり引込んだりす
るエジェクタを有することを特徴とする樹脂封止金型。In a resin sealing mold in which a recess is formed on the mold surface to cover the outer contour of a semiconductor chip mounted on an island of a lead frame, and an air vent groove is formed around this recess, the air release groove is A resin sealing mold characterized by having an ejector that protrudes and retracts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10041989A JPH02278741A (en) | 1989-04-19 | 1989-04-19 | Resin-sealing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10041989A JPH02278741A (en) | 1989-04-19 | 1989-04-19 | Resin-sealing mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02278741A true JPH02278741A (en) | 1990-11-15 |
Family
ID=14273459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10041989A Pending JPH02278741A (en) | 1989-04-19 | 1989-04-19 | Resin-sealing mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02278741A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995026865A1 (en) * | 1994-03-30 | 1995-10-12 | Sankyokasei Kabushiki Kaisha | Resin molding method and resin molding machine |
-
1989
- 1989-04-19 JP JP10041989A patent/JPH02278741A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995026865A1 (en) * | 1994-03-30 | 1995-10-12 | Sankyokasei Kabushiki Kaisha | Resin molding method and resin molding machine |
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