JPH0226391B2 - - Google Patents

Info

Publication number
JPH0226391B2
JPH0226391B2 JP61116036A JP11603686A JPH0226391B2 JP H0226391 B2 JPH0226391 B2 JP H0226391B2 JP 61116036 A JP61116036 A JP 61116036A JP 11603686 A JP11603686 A JP 11603686A JP H0226391 B2 JPH0226391 B2 JP H0226391B2
Authority
JP
Japan
Prior art keywords
chip
contact
flexible circuit
pads
contact pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61116036A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6225446A (ja
Inventor
Aaru Sumisu Kenesu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of JPS6225446A publication Critical patent/JPS6225446A/ja
Publication of JPH0226391B2 publication Critical patent/JPH0226391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP61116036A 1985-05-20 1986-05-20 Ｉｃパツケ−ジ Granted JPS6225446A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/736,204 US4647959A (en) 1985-05-20 1985-05-20 Integrated circuit package, and method of forming an integrated circuit package
US736204 1985-05-20

Publications (2)

Publication Number Publication Date
JPS6225446A JPS6225446A (ja) 1987-02-03
JPH0226391B2 true JPH0226391B2 (enExample) 1990-06-08

Family

ID=24958934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61116036A Granted JPS6225446A (ja) 1985-05-20 1986-05-20 Ｉｃパツケ−ジ

Country Status (3)

Country Link
US (1) US4647959A (enExample)
JP (1) JPS6225446A (enExample)
DE (1) DE3616494A1 (enExample)

Families Citing this family (47)

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US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4918571A (en) * 1987-03-31 1990-04-17 Amp Incorporated Chip carrier with energy storage means
EP0285277A1 (en) * 1987-03-31 1988-10-05 Amp Incorporated Chip carrier with energy storage means
US4887147A (en) * 1987-07-01 1989-12-12 Digital Equipment Corporation Thermal package for electronic components
US4796156A (en) * 1987-12-04 1989-01-03 General Electric Company Self packaging chip mount
US4903113A (en) * 1988-01-15 1990-02-20 International Business Machines Corporation Enhanced tab package
US4933747A (en) * 1989-03-27 1990-06-12 Motorola Inc. Interconnect and cooling system for a semiconductor device
US5258649A (en) * 1989-05-20 1993-11-02 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
JPH04503283A (ja) * 1989-07-03 1992-06-11 ゼネラル・エレクトリック・カンパニイ 半導体チップを含むインダクタンスの小さいカプセル封じパッケージ
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5018005A (en) * 1989-12-27 1991-05-21 Motorola Inc. Thin, molded, surface mount electronic device
NL9000161A (nl) * 1990-01-23 1991-08-16 Koninkl Philips Electronics Nv Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager.
USH1267H (en) 1990-07-05 1993-12-07 Boyd Melissa D Integrated circuit and lead frame assembly
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
US5298686A (en) * 1990-10-23 1994-03-29 Westinghouse Electric Corp. System and method for implementing wiring changes in a solderless printed wiring board module
DE4111247C3 (de) * 1991-04-08 1996-11-21 Export Contor Ausenhandelsgese Schaltungsanordnung
US5261593A (en) * 1992-08-19 1993-11-16 Sheldahl, Inc. Direct application of unpackaged integrated circuit to flexible printed circuit
US5409863A (en) * 1993-02-19 1995-04-25 Lsi Logic Corporation Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
JPH0846104A (ja) * 1994-05-31 1996-02-16 Motorola Inc 表面実装電子素子およびその製造方法
AU3415095A (en) * 1994-09-06 1996-03-27 Sheldahl, Inc. Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
JP3256636B2 (ja) * 1994-09-15 2002-02-12 株式会社東芝 圧接型半導体装置
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
US5937515A (en) * 1995-04-25 1999-08-17 Johnson; Morgan T. Reconfigurable circuit fabrication method
US5745985A (en) * 1995-06-23 1998-05-05 Texas Instruments Incorporated Method of attaching a semiconductor microchip to a circuit board
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US5834335A (en) * 1995-09-28 1998-11-10 Texas Instruments Incorporated Non-metallurgical connection between an integrated circuit and a circuit board or another integrated circuit
US6097099A (en) * 1995-10-20 2000-08-01 Texas Instruments Incorporated Electro-thermal nested die-attach design
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
FR2757682B1 (fr) * 1996-12-20 1999-03-12 Thomson Tubes Electroniques Procede et dispositif de connexion d'un composant semiconducteur sur un substrat equipe de conducteurs
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
DE10019443A1 (de) * 2000-04-19 2001-10-31 Texas Instruments Deutschland Vorrichtung zum Befestigen eines Halbleiter-Chips auf einem Chip-Träger
US7238550B2 (en) * 2002-02-26 2007-07-03 Tandon Group Ltd. Methods and apparatus for fabricating Chip-on-Board modules
US7142909B2 (en) * 2002-04-11 2006-11-28 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
DE10334634B3 (de) * 2003-07-29 2005-01-13 Infineon Technologies Ag Verfahren zum seitlichen Kontaktieren eines Halbleiterchips
CN101507379A (zh) 2005-09-06 2009-08-12 超刀片公司 三维多层模块化计算机体系结构
DE112006002428A5 (de) * 2005-09-14 2008-12-11 Htc Beteiligungs Gmbh Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
DE102005043910A1 (de) * 2005-09-14 2007-03-15 Weissbach, Ernst-A. Flip-Chip-Modul und Verfahren zum Erzeugen eines Flip-Chip-Moduls
US7982307B2 (en) * 2006-11-22 2011-07-19 Agere Systems Inc. Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
TW200836315A (en) * 2007-02-16 2008-09-01 Richtek Techohnology Corp Electronic package structure and method thereof
JP5084553B2 (ja) * 2008-02-26 2012-11-28 京セラ株式会社 セグメント型熱電素子、熱電モジュール、発電装置および温度調節装置
US8632221B2 (en) * 2011-11-01 2014-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. LED module and method of bonding thereof
US10559486B1 (en) * 2018-01-10 2020-02-11 Facebook Technologies, Llc Method for polymer-assisted chip transfer
US10586725B1 (en) * 2018-01-10 2020-03-10 Facebook Technologies, Llc Method for polymer-assisted chip transfer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780352A (en) * 1968-06-25 1973-12-18 J Redwanz Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
US4042861A (en) * 1973-11-08 1977-08-16 Citizen Watch Company Limited Mounting arrangement for an integrated circuit unit in an electronic digital watch
US3991463A (en) * 1975-05-19 1976-11-16 Chomerics, Inc. Method of forming an interconnector
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
DE7908771U1 (de) * 1979-03-28 1979-07-19 Metz Apparatewerke Inh. Paul Metz, 8510 Fuerth Anordnung einer integrierten schaltung auf einer leiterplatte
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
DE3046192A1 (de) * 1980-12-08 1982-07-15 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer ic-bausteine
US4446477A (en) * 1981-08-21 1984-05-01 Sperry Corporation Multichip thin film module

Also Published As

Publication number Publication date
JPS6225446A (ja) 1987-02-03
DE3616494C2 (enExample) 1991-04-25
US4647959A (en) 1987-03-03
DE3616494A1 (de) 1986-11-27

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