JPH0225570Y2 - - Google Patents
Info
- Publication number
- JPH0225570Y2 JPH0225570Y2 JP8578488U JP8578488U JPH0225570Y2 JP H0225570 Y2 JPH0225570 Y2 JP H0225570Y2 JP 8578488 U JP8578488 U JP 8578488U JP 8578488 U JP8578488 U JP 8578488U JP H0225570 Y2 JPH0225570 Y2 JP H0225570Y2
- Authority
- JP
- Japan
- Prior art keywords
- belt
- heated
- speed
- heating
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000006071 cream Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8578488U JPH0225570Y2 (ko) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8578488U JPH0225570Y2 (ko) | 1988-06-30 | 1988-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211663U JPH0211663U (ko) | 1990-01-24 |
| JPH0225570Y2 true JPH0225570Y2 (ko) | 1990-07-13 |
Family
ID=31310438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8578488U Expired JPH0225570Y2 (ko) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225570Y2 (ko) |
-
1988
- 1988-06-30 JP JP8578488U patent/JPH0225570Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211663U (ko) | 1990-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0225570Y2 (ko) | ||
| EP0084464A3 (en) | Connector for electronic subassemblies | |
| US6691407B2 (en) | Methods for retaining assembled components | |
| JPH0749151B2 (ja) | ハンダ付けリフロー炉 | |
| US3553824A (en) | Process for eliminating icicle-like formations on soldered circuit substrates | |
| JP2665926B2 (ja) | プリント基板のリフロー方法 | |
| JPH02129993A (ja) | 両面プリント配線基板の製造方法 | |
| JPH05129753A (ja) | デイスクリート部品およびデイスクリート部品のプリント基板実装方法 | |
| JPH05152733A (ja) | 表面実装用プリント配線基板 | |
| JPH0254989A (ja) | 電子部品の半田付け方法 | |
| JPH04154190A (ja) | チップ部品の実装方法 | |
| JPH0216856Y2 (ko) | ||
| JPS6419688A (en) | Method of soldering lead to printed wiring board | |
| JPS58111394A (ja) | 電子回路基板 | |
| JPS6317581Y2 (ko) | ||
| JPS6437077A (en) | Reflow soldering | |
| JP2628935B2 (ja) | 半同軸誘電体共振子の固定方法 | |
| JPS62128553A (ja) | 半導体パツケ−ジの製造法 | |
| JPH0340489A (ja) | 電子部品の半田付け方法 | |
| JPS63157493A (ja) | プリント基板およびその使用方法 | |
| JPS59219988A (ja) | はんだ付方法 | |
| JP4186284B2 (ja) | 加熱装置 | |
| JPH0113240B2 (ko) | ||
| JPH02251196A (ja) | マウント方法 | |
| JPS59165497A (ja) | 実装基板の製造方法 |