JPH022546Y2 - - Google Patents

Info

Publication number
JPH022546Y2
JPH022546Y2 JP9637484U JP9637484U JPH022546Y2 JP H022546 Y2 JPH022546 Y2 JP H022546Y2 JP 9637484 U JP9637484 U JP 9637484U JP 9637484 U JP9637484 U JP 9637484U JP H022546 Y2 JPH022546 Y2 JP H022546Y2
Authority
JP
Japan
Prior art keywords
conductive paste
paste
pellet
syringe
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9637484U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112569U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9637484U priority Critical patent/JPS6112569U/ja
Publication of JPS6112569U publication Critical patent/JPS6112569U/ja
Application granted granted Critical
Publication of JPH022546Y2 publication Critical patent/JPH022546Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9637484U 1984-06-26 1984-06-26 導電ペ−スト供給装置 Granted JPS6112569U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9637484U JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Publications (2)

Publication Number Publication Date
JPS6112569U JPS6112569U (ja) 1986-01-24
JPH022546Y2 true JPH022546Y2 (enrdf_load_html_response) 1990-01-22

Family

ID=30655819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9637484U Granted JPS6112569U (ja) 1984-06-26 1984-06-26 導電ペ−スト供給装置

Country Status (1)

Country Link
JP (1) JPS6112569U (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS6112569U (ja) 1986-01-24

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