JPH0224378B2 - - Google Patents

Info

Publication number
JPH0224378B2
JPH0224378B2 JP58237807A JP23780783A JPH0224378B2 JP H0224378 B2 JPH0224378 B2 JP H0224378B2 JP 58237807 A JP58237807 A JP 58237807A JP 23780783 A JP23780783 A JP 23780783A JP H0224378 B2 JPH0224378 B2 JP H0224378B2
Authority
JP
Japan
Prior art keywords
bonding
fixed
carrier
axis
base frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58237807A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60130131A (ja
Inventor
Hideaki Myoshi
Tadashi Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP58237807A priority Critical patent/JPS60130131A/ja
Publication of JPS60130131A publication Critical patent/JPS60130131A/ja
Publication of JPH0224378B2 publication Critical patent/JPH0224378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58237807A 1983-12-19 1983-12-19 ボンデイング装置 Granted JPS60130131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58237807A JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58237807A JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60130131A JPS60130131A (ja) 1985-07-11
JPH0224378B2 true JPH0224378B2 (enrdf_load_stackoverflow) 1990-05-29

Family

ID=17020697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58237807A Granted JPS60130131A (ja) 1983-12-19 1983-12-19 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60130131A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748243A (en) * 1980-09-06 1982-03-19 Shinkawa Ltd Wire bonding apparatus

Also Published As

Publication number Publication date
JPS60130131A (ja) 1985-07-11

Similar Documents

Publication Publication Date Title
US5465899A (en) Method and apparatus for fine pitch wire bonding using a shaved capillary
US5427301A (en) Ultrasonic flip chip process and apparatus
EP0724776B1 (en) Method for stitch bonding of wires to integrated circuit bonding pads
JPS60259328A (ja) 放電加工切断装置
JPH04118942A (ja) ワイヤボンディング方法、およびその装置
JP2001144134A (ja) ボンディング装置のボンディングヘッドにおける振動子ブロックの支持方法
US7320424B2 (en) Linear split axis wire bonder
KR20020085755A (ko) 플립 칩과 같은 반도체 칩을 기판에 배치하는 장치
JPH0224378B2 (enrdf_load_stackoverflow)
CN100587932C (zh) 导线键合的方法和装置
JP2954093B2 (ja) ワイヤボンディング装置
JPH0513517A (ja) ワイヤボンデイング装置及びワイヤボンデイング方法
JP2757037B2 (ja) ボンディング装置
JP2921164B2 (ja) リードのボンディング装置
JPS59186333A (ja) ボンデイング装置
JPS63124430A (ja) ワイヤボンデイング装置
JPH0810188Y2 (ja) ボンディング装置
KR101949591B1 (ko) 경사 리드를 구비한 연성 소재 부품 본딩 장치
JP4149718B2 (ja) 部品実装方法
JPH01241138A (ja) 半導体装置のワイヤボンディング方法
JP3086124B2 (ja) ボンディング用バンプの形成方法および装置
JPS62248240A (ja) バンプ形成方法
JP2550905B2 (ja) ワイヤボンディング装置
JPH0462944A (ja) インナーリードボンディング方法
JPS58161333A (ja) 半導体製造装置