JPH0224012B2 - - Google Patents

Info

Publication number
JPH0224012B2
JPH0224012B2 JP61231087A JP23108786A JPH0224012B2 JP H0224012 B2 JPH0224012 B2 JP H0224012B2 JP 61231087 A JP61231087 A JP 61231087A JP 23108786 A JP23108786 A JP 23108786A JP H0224012 B2 JPH0224012 B2 JP H0224012B2
Authority
JP
Japan
Prior art keywords
stage
wafer
frame
mask
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61231087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6387725A (ja
Inventor
Shiro Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP61231087A priority Critical patent/JPS6387725A/ja
Publication of JPS6387725A publication Critical patent/JPS6387725A/ja
Publication of JPH0224012B2 publication Critical patent/JPH0224012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61231087A 1986-10-01 1986-10-01 ステ−ジ移動機構 Granted JPS6387725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61231087A JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61231087A JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Publications (2)

Publication Number Publication Date
JPS6387725A JPS6387725A (ja) 1988-04-19
JPH0224012B2 true JPH0224012B2 (cs) 1990-05-28

Family

ID=16918081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61231087A Granted JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Country Status (1)

Country Link
JP (1) JPS6387725A (cs)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374147A (en) * 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
JP4078683B2 (ja) * 1996-11-28 2008-04-23 株式会社ニコン 投影露光装置及び投影露光方法並びに走査露光方法
ATE404906T1 (de) 1996-11-28 2008-08-15 Nikon Corp Ausrichtvorrichtung und belichtungsverfahren
JPH10209039A (ja) 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
TW527526B (en) 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
JP4932330B2 (ja) * 2006-05-31 2012-05-16 Ｎｓｋテクノロジー株式会社 露光装置
JP4886719B2 (ja) * 2008-03-14 2012-02-29 日立ビアメカニクス株式会社 加工装置
JP5298157B2 (ja) * 2011-04-21 2013-09-25 西進商事株式会社 レーザー加工装置、レーザー加工方法及びレーザー加工物
JP6353487B2 (ja) * 2016-05-26 2018-07-04 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法

Also Published As

Publication number Publication date
JPS6387725A (ja) 1988-04-19

Similar Documents

Publication Publication Date Title
EP0906590B1 (en) Lithographic projection apparatus with off-axis alignment unit
EP0956518B1 (en) Interferometer system and lithographic apparatus comprising such a system
JPH0224012B2 (cs)
KR20010091971A (ko) 얼라인먼트 장치, 얼라인먼트 방법, 노광 장치 및 노광 방법
EP0706093B1 (en) Method and apparatus for aligning a mask and a workpiece
US5717492A (en) Position detecting apparatus and a method for manufacturing semiconductor devices using the apparatus
KR100577476B1 (ko) 노광 장치 및 이 장치를 이용한 반도체 장치의 제조 방법
US5726757A (en) Alignment method
CN1133866C (zh) 差分干涉仪系统和配有该系统的平版印刷分步扫描装置
JP2000299276A (ja) 露光装置
JPH10177950A (ja) ステージ装置及び投影光学装置
KR100283838B1 (ko) 스캔노광장치및스캔노광방법
JP3352280B2 (ja) 投影露光装置の調整方法及び露光方法
JPH0723933B2 (ja) 光路長補償光学系
JP2580572B2 (ja) 投影露光装置
JPH01289592A (ja) レーザ加工装置
JP2819592B2 (ja) 位置合わせ装置
JPS63150916A (ja) アライメント方法及びアライメント装置の校正用基板
JP3027870B2 (ja) 位置検出装置及び半導体素子の製造方法
JPS59163824A (ja) アライメントスコ−プ
JPS62262423A (ja) 露光装置
JPH02207522A (ja) 露光装置
JPH05136024A (ja) 投影露光装置
JP2005322728A (ja) 露光装置
JPS61212081A (ja) 光学装置