JPH0222995Y2 - - Google Patents

Info

Publication number
JPH0222995Y2
JPH0222995Y2 JP1984120337U JP12033784U JPH0222995Y2 JP H0222995 Y2 JPH0222995 Y2 JP H0222995Y2 JP 1984120337 U JP1984120337 U JP 1984120337U JP 12033784 U JP12033784 U JP 12033784U JP H0222995 Y2 JPH0222995 Y2 JP H0222995Y2
Authority
JP
Japan
Prior art keywords
heat sink
substrate
resin material
semiconductor pellet
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984120337U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6134737U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12033784U priority Critical patent/JPS6134737U/ja
Publication of JPS6134737U publication Critical patent/JPS6134737U/ja
Application granted granted Critical
Publication of JPH0222995Y2 publication Critical patent/JPH0222995Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12033784U 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置 Granted JPS6134737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12033784U JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12033784U JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS6134737U JPS6134737U (ja) 1986-03-03
JPH0222995Y2 true JPH0222995Y2 (cs) 1990-06-21

Family

ID=30679161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12033784U Granted JPS6134737U (ja) 1984-08-03 1984-08-03 樹脂モ−ルド型半導体装置

Country Status (1)

Country Link
JP (1) JPS6134737U (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4424916Y1 (cs) * 1966-10-28 1969-10-20
JPS5429974A (en) * 1977-08-10 1979-03-06 Hitachi Ltd Semiconductor device of resin sealing type

Also Published As

Publication number Publication date
JPS6134737U (ja) 1986-03-03

Similar Documents

Publication Publication Date Title
US4943843A (en) Semiconductor device
JP2002151554A (ja) 半導体装置
US5234866A (en) Semiconductor device and process for producing the same, and lead frame used in said process
JPH0222995Y2 (cs)
JPS62205653A (ja) リ−ドフレ−ムおよび半導体装置の製造方法
JPS58151035A (ja) 半導体装置の製造方法
JPS61107751A (ja) 樹脂モ−ルド型半導体装置
JPS59207646A (ja) 半導体装置およびリ−ドフレ−ム
JPH03149865A (ja) リードフレーム
EP0582084A2 (en) Semiconductor leadframe and package
JPS63141353A (ja) 樹脂封止型半導体装置とその製造方法
JPH0821662B2 (ja) 半導体装置用リ−ドフレ−ム
JPS5927066Y2 (ja) 樹脂封止半導体装置
JPS622777Y2 (cs)
JPS60175433A (ja) 樹脂封止型半導体装置の製造方法およびリ−ドフレ−ム
JPH01123447A (ja) 樹脂封止型電子部品の製造方法
JPS5812736B2 (ja) ジユシフウシガタハンドウタイソウチ
JPS6366427B2 (cs)
JP2552887Y2 (ja) 絶縁物被覆電子部品
JPS6344991Y2 (cs)
JPS6125255Y2 (cs)
JPS6167943A (ja) 絶縁型半導体装置およびその製造に用いるモ−ルド型
JPS6020939Y2 (ja) 半導体装置パツケ−ジ用基板
JPS589371B2 (ja) 温度検出装置
JPS647496B2 (cs)