JPH0222989Y2 - - Google Patents

Info

Publication number
JPH0222989Y2
JPH0222989Y2 JP1982091560U JP9156082U JPH0222989Y2 JP H0222989 Y2 JPH0222989 Y2 JP H0222989Y2 JP 1982091560 U JP1982091560 U JP 1982091560U JP 9156082 U JP9156082 U JP 9156082U JP H0222989 Y2 JPH0222989 Y2 JP H0222989Y2
Authority
JP
Japan
Prior art keywords
solder
semiconductor chip
chip bonding
bonding part
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982091560U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58195435U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9156082U priority Critical patent/JPS58195435U/ja
Publication of JPS58195435U publication Critical patent/JPS58195435U/ja
Application granted granted Critical
Publication of JPH0222989Y2 publication Critical patent/JPH0222989Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9156082U 1982-06-21 1982-06-21 半導体装置 Granted JPS58195435U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9156082U JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9156082U JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS58195435U JPS58195435U (ja) 1983-12-26
JPH0222989Y2 true JPH0222989Y2 (enEXAMPLES) 1990-06-21

Family

ID=30221567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9156082U Granted JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS58195435U (enEXAMPLES)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5517488A (en) * 1978-07-25 1980-02-06 Sharp Corp Electronic watch having another clock function
JPS5753948A (ja) * 1980-09-17 1982-03-31 Toshiba Corp Handotaisoshinomauntohoho

Also Published As

Publication number Publication date
JPS58195435U (ja) 1983-12-26

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