JPH0222966B2 - - Google Patents
Info
- Publication number
- JPH0222966B2 JPH0222966B2 JP1921282A JP1921282A JPH0222966B2 JP H0222966 B2 JPH0222966 B2 JP H0222966B2 JP 1921282 A JP1921282 A JP 1921282A JP 1921282 A JP1921282 A JP 1921282A JP H0222966 B2 JPH0222966 B2 JP H0222966B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- photosensitive resin
- resin film
- alumite
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 26
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZKKLPDLKUGTPME-UHFFFAOYSA-N diazanium;bis(sulfanylidene)molybdenum;sulfanide Chemical compound [NH4+].[NH4+].[SH-].[SH-].S=[Mo]=S ZKKLPDLKUGTPME-UHFFFAOYSA-N 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1921282A JPS58137915A (ja) | 1982-02-09 | 1982-02-09 | 回路板の形成方法 |
| US06/430,601 US4463084A (en) | 1982-02-09 | 1982-09-30 | Method of fabricating a circuit board and circuit board provided thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1921282A JPS58137915A (ja) | 1982-02-09 | 1982-02-09 | 回路板の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58137915A JPS58137915A (ja) | 1983-08-16 |
| JPH0222966B2 true JPH0222966B2 (zh) | 1990-05-22 |
Family
ID=11993058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1921282A Granted JPS58137915A (ja) | 1982-02-09 | 1982-02-09 | 回路板の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58137915A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5385682B2 (ja) | 2009-05-19 | 2014-01-08 | 新光電気工業株式会社 | 電子部品の実装構造 |
| JP5249132B2 (ja) | 2009-06-03 | 2013-07-31 | 新光電気工業株式会社 | 配線基板 |
| JP5460155B2 (ja) | 2009-07-14 | 2014-04-02 | 新光電気工業株式会社 | キャパシタ及び配線基板 |
| JP5280309B2 (ja) | 2009-07-17 | 2013-09-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| JP5436963B2 (ja) | 2009-07-21 | 2014-03-05 | 新光電気工業株式会社 | 配線基板及び半導体装置 |
| JP2011151185A (ja) | 2010-01-21 | 2011-08-04 | Shinko Electric Ind Co Ltd | 配線基板及び半導体装置 |
| JP5363384B2 (ja) | 2010-03-11 | 2013-12-11 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
-
1982
- 1982-02-09 JP JP1921282A patent/JPS58137915A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58137915A (ja) | 1983-08-16 |
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