JPH022291B2 - - Google Patents

Info

Publication number
JPH022291B2
JPH022291B2 JP59128261A JP12826184A JPH022291B2 JP H022291 B2 JPH022291 B2 JP H022291B2 JP 59128261 A JP59128261 A JP 59128261A JP 12826184 A JP12826184 A JP 12826184A JP H022291 B2 JPH022291 B2 JP H022291B2
Authority
JP
Japan
Prior art keywords
chip
potential
die pad
hybrid
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59128261A
Other languages
English (en)
Japanese (ja)
Other versions
JPS617646A (ja
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59128261A priority Critical patent/JPS617646A/ja
Publication of JPS617646A publication Critical patent/JPS617646A/ja
Publication of JPH022291B2 publication Critical patent/JPH022291B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611
    • H10W20/40
    • H10W70/641
    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Die Bonding (AREA)
JP59128261A 1984-06-21 1984-06-21 ハイブリツドicの変更方法 Granted JPS617646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128261A JPS617646A (ja) 1984-06-21 1984-06-21 ハイブリツドicの変更方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128261A JPS617646A (ja) 1984-06-21 1984-06-21 ハイブリツドicの変更方法

Publications (2)

Publication Number Publication Date
JPS617646A JPS617646A (ja) 1986-01-14
JPH022291B2 true JPH022291B2 (enExample) 1990-01-17

Family

ID=14980470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128261A Granted JPS617646A (ja) 1984-06-21 1984-06-21 ハイブリツドicの変更方法

Country Status (1)

Country Link
JP (1) JPS617646A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558354A (ja) * 1991-08-29 1993-03-09 Iseki & Co Ltd クロ−ラ式走行装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6906411B1 (en) 2000-06-29 2005-06-14 Mitsubishi Denki Kabushiki Kaisha Multilayer substrate module and portable wireless terminal
JP4662507B1 (ja) * 2009-11-05 2011-03-30 株式会社椿本チエイン 噛合チェーン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558354A (ja) * 1991-08-29 1993-03-09 Iseki & Co Ltd クロ−ラ式走行装置

Also Published As

Publication number Publication date
JPS617646A (ja) 1986-01-14

Similar Documents

Publication Publication Date Title
US5604673A (en) Low temperature co-fired ceramic substrates for power converters
US6902951B2 (en) Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
US5606199A (en) Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame
JPH07183333A (ja) 電子パッケージおよびその作製方法
US5473190A (en) Tab tape
US4949220A (en) Hybrid IC with heat sink
JPH0477469B2 (enExample)
KR940006187Y1 (ko) 반도체장치
KR930000614B1 (ko) 반도체 집적회로장치
JPH06508723A (ja) 集積回路に電源を供給する方法
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPH022291B2 (enExample)
US6020631A (en) Method and apparatus for connecting a bondwire to a bondring near a via
JPH0365662B2 (enExample)
JPS617657A (ja) マルチチツプパツケ−ジ
JP3090115B2 (ja) 半導体装置およびその製造方法
JP2837521B2 (ja) 半導体集積回路装置およびその配線変更方法
JPH04129250A (ja) 薄型混成集積回路基板
JPH0517709B2 (enExample)
JP3740197B2 (ja) 電子部品、電子部品製造用基板および電子部品の製造方法
KR960019683A (ko) 반도체 장치
JPH0741161Y2 (ja) 混成集積回路
JPS617658A (ja) ハイブリツドicの接続変更方法
JPH0735413Y2 (ja) 混成集積回路におけるチツプ電子部品の取付構造
JPH0478172B2 (enExample)