JPH022289B2 - - Google Patents

Info

Publication number
JPH022289B2
JPH022289B2 JP56139479A JP13947981A JPH022289B2 JP H022289 B2 JPH022289 B2 JP H022289B2 JP 56139479 A JP56139479 A JP 56139479A JP 13947981 A JP13947981 A JP 13947981A JP H022289 B2 JPH022289 B2 JP H022289B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip mounting
pin
heat
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56139479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5842259A (ja
Inventor
Nobuhiko Mizuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56139479A priority Critical patent/JPS5842259A/ja
Publication of JPS5842259A publication Critical patent/JPS5842259A/ja
Publication of JPH022289B2 publication Critical patent/JPH022289B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/075—
    • H10W72/07554—
    • H10W72/5449—
    • H10W72/547—
    • H10W72/884—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP56139479A 1981-09-04 1981-09-04 半導体パッケージの製造方法 Granted JPS5842259A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56139479A JPS5842259A (ja) 1981-09-04 1981-09-04 半導体パッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56139479A JPS5842259A (ja) 1981-09-04 1981-09-04 半導体パッケージの製造方法

Publications (2)

Publication Number Publication Date
JPS5842259A JPS5842259A (ja) 1983-03-11
JPH022289B2 true JPH022289B2 (cg-RX-API-DMAC10.html) 1990-01-17

Family

ID=15246203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56139479A Granted JPS5842259A (ja) 1981-09-04 1981-09-04 半導体パッケージの製造方法

Country Status (1)

Country Link
JP (1) JPS5842259A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106635A (ja) * 1985-11-01 1987-05-18 Mitsubishi Electric Corp 半導体装置
JPH079953B2 (ja) * 1988-04-13 1995-02-01 株式会社東芝 半導体装置の製造方法
JP2562090Y2 (ja) * 1990-02-14 1998-02-04 旭光学工業株式会社 実像式ファインダの視野調整装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638846A (en) * 1979-09-07 1981-04-14 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5842259A (ja) 1983-03-11

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