JPH0222578U - - Google Patents

Info

Publication number
JPH0222578U
JPH0222578U JP1988099459U JP9945988U JPH0222578U JP H0222578 U JPH0222578 U JP H0222578U JP 1988099459 U JP1988099459 U JP 1988099459U JP 9945988 U JP9945988 U JP 9945988U JP H0222578 U JPH0222578 U JP H0222578U
Authority
JP
Japan
Prior art keywords
sealable
adhesive heat
connector
resin layer
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988099459U
Other languages
English (en)
Other versions
JPH0615429Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988099459U priority Critical patent/JPH0615429Y2/ja
Priority to GB8916322A priority patent/GB2222327B/en
Priority to KR1019890010669A priority patent/KR950004369B1/ko
Publication of JPH0222578U publication Critical patent/JPH0222578U/ja
Application granted granted Critical
Publication of JPH0615429Y2 publication Critical patent/JPH0615429Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Resistance Heating (AREA)

Description

【図面の簡単な説明】
第１図、第２図、第３図は本考案の接着性熱融
着形コネクタの斜視図、第４図は第１図に示した
コネクタの実用状態を示す組立て前の斜視図、第
５図は第４図におけるコネクタと導体パターンの
組立て後の接続状態を示す拡大縦断面図、第６図
は第３図に示したコネクタの使用状態を示す斜視
図、第７図は絶縁性樹脂層と導電性樹脂層を積層
一体化したのちスライスして得た接着性熱融着性
シートの斜視図、第８図〜第１１図は本考案の接
着性熱融着形コネクタの物性値を示したグラフ、
第１２図は従来公知の異方導電性樹脂組成物を用
いて基板接栓とフラツトケーブルとを接続したと
きの縦断面図を示したものである。 １ａ，１ｂ，１ｃ……接着性熱融着形コネクタ
、２，４……絶縁性樹脂層、３……導電性樹脂層
、５……コネクタ、１２……ガラス基板、プリン
ト基板、１３，１６……基板接栓、１５……絶縁
性ベースフイルム、２１……ＩＣ、２２……ＩＣ
電極、２３……プリント基板、２４……プリント
基板電極、３１……フラツトケーブル、３２……
絶縁性ベースフイルム、３３，３６……導体パタ
ーン、３５……ガラス基板またはプリント基板、
３７……接着性異方導電性組成物、３８……接着
性絶縁性樹脂、３９……導電性粒子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 接着性熱融着形の等方導電性樹脂層と接着性熱
    融着形の絶縁樹脂層を交互に多重に積層一体化し
    たのち、該積層面に対し所定の角度を有する面で
    スライス加工して得た導電性層が縞状に配置され
    た接着性熱融着形コネクタの少なくとも両側面に
    接着性熱融着形の絶縁性樹脂層を設けてなること
    を特徴とする接着性熱融着形コネクタ。
JP1988099459U 1988-07-27 1988-07-27 接着性熱融着形コネクタ Expired - Lifetime JPH0615429Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1988099459U JPH0615429Y2 (ja) 1988-07-27 1988-07-27 接着性熱融着形コネクタ
GB8916322A GB2222327B (en) 1988-07-27 1989-07-17 Hot-melt adhesive interconnector
KR1019890010669A KR950004369B1 (ko) 1988-07-27 1989-07-27 접착성 열 융착형 인터커넥터

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988099459U JPH0615429Y2 (ja) 1988-07-27 1988-07-27 接着性熱融着形コネクタ

Publications (2)

Publication Number Publication Date
JPH0222578U true JPH0222578U (ja) 1990-02-15
JPH0615429Y2 JPH0615429Y2 (ja) 1994-04-20

Family

ID=14247902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988099459U Expired - Lifetime JPH0615429Y2 (ja) 1988-07-27 1988-07-27 接着性熱融着形コネクタ

Country Status (3)

Country Link
JP (1) JPH0615429Y2 (ja)
KR (1) KR950004369B1 (ja)
GB (1) GB2222327B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521121A (ja) * 1991-06-28 1993-01-29 Shin Etsu Polymer Co Ltd エラスチツクコネクタ−の製造方法
JPH05121137A (ja) * 1991-04-19 1993-05-18 Daini Shinano Polymer Kk サポート付きインターコネクターの製造方法
JPH0645041A (ja) * 1992-03-27 1994-02-18 Daini Shinano Polymer Kk 偏心タイプのサポート付きインターコネクターの製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420604A1 (en) * 1989-09-27 1991-04-03 Motorola, Inc. Selectively conductive adhesive device for simultaneous electrical and mechanical coupling
JPH0831350B2 (ja) * 1989-10-03 1996-03-27 日本黒鉛工業株式会社 ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
TWI434119B (zh) * 2006-06-28 2014-04-11 Creator Technology Bv 用於可撓性顯示器之改良的共同接點佈局
US7766667B2 (en) 2007-12-18 2010-08-03 Russell James V Separable electrical connectors using isotropic conductive elastomer interconnect medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100676A (en) * 1979-01-24 1980-07-31 Fujikura Rubber Works Ltd Method of manufacturing conductive connector
JPS58169679U (ja) * 1982-05-10 1983-11-12 東レ株式会社 エラスチツク・コネクタ−
JPS6251111A (ja) * 1985-08-29 1987-03-05 日東電工株式会社 異方導電性フイルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201435A (en) * 1976-07-26 1980-05-06 Shin-Etsu Polymer Co. Ltd. Interconnectors
JPS5652885A (en) * 1979-10-03 1981-05-12 Shinetsu Polymer Co Pressure nipping type connector
JPH01206575A (ja) * 1988-02-15 1989-08-18 Shin Etsu Polymer Co Ltd 接着性熱融着形コネクタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100676A (en) * 1979-01-24 1980-07-31 Fujikura Rubber Works Ltd Method of manufacturing conductive connector
JPS58169679U (ja) * 1982-05-10 1983-11-12 東レ株式会社 エラスチツク・コネクタ−
JPS6251111A (ja) * 1985-08-29 1987-03-05 日東電工株式会社 異方導電性フイルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121137A (ja) * 1991-04-19 1993-05-18 Daini Shinano Polymer Kk サポート付きインターコネクターの製造方法
JPH0521121A (ja) * 1991-06-28 1993-01-29 Shin Etsu Polymer Co Ltd エラスチツクコネクタ−の製造方法
JPH0645041A (ja) * 1992-03-27 1994-02-18 Daini Shinano Polymer Kk 偏心タイプのサポート付きインターコネクターの製造方法

Also Published As

Publication number Publication date
GB8916322D0 (en) 1989-08-31
GB2222327B (en) 1992-10-28
GB2222327A (en) 1990-02-28
JPH0615429Y2 (ja) 1994-04-20
KR950004369B1 (ko) 1995-04-28
KR900002493A (ko) 1990-02-28

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