GB2222327B - Hot-melt adhesive interconnector - Google Patents

Hot-melt adhesive interconnector

Info

Publication number
GB2222327B
GB2222327B GB8916322A GB8916322A GB2222327B GB 2222327 B GB2222327 B GB 2222327B GB 8916322 A GB8916322 A GB 8916322A GB 8916322 A GB8916322 A GB 8916322A GB 2222327 B GB2222327 B GB 2222327B
Authority
GB
United Kingdom
Prior art keywords
interconnector
hot
melt adhesive
melt
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8916322A
Other versions
GB8916322D0 (en
GB2222327A (en
Inventor
Akio Nakamura
Hideki Tabei
Osami Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of GB8916322D0 publication Critical patent/GB8916322D0/en
Publication of GB2222327A publication Critical patent/GB2222327A/en
Application granted granted Critical
Publication of GB2222327B publication Critical patent/GB2222327B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
GB8916322A 1988-07-27 1989-07-17 Hot-melt adhesive interconnector Expired - Fee Related GB2222327B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988099459U JPH0615429Y2 (en) 1988-07-27 1988-07-27 Adhesive heat fusion type connector

Publications (3)

Publication Number Publication Date
GB8916322D0 GB8916322D0 (en) 1989-08-31
GB2222327A GB2222327A (en) 1990-02-28
GB2222327B true GB2222327B (en) 1992-10-28

Family

ID=14247902

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8916322A Expired - Fee Related GB2222327B (en) 1988-07-27 1989-07-17 Hot-melt adhesive interconnector

Country Status (3)

Country Link
JP (1) JPH0615429Y2 (en)
KR (1) KR950004369B1 (en)
GB (1) GB2222327B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420604A1 (en) * 1989-09-27 1991-04-03 Motorola, Inc. Selectively conductive adhesive device for simultaneous electrical and mechanical coupling
JPH0831350B2 (en) * 1989-10-03 1996-03-27 日本黒鉛工業株式会社 Manufacturing method of conductive anisotropic heat seal connector member for fine pitch
JP2535677B2 (en) * 1991-04-19 1996-09-18 信越ポリマー株式会社 Manufacturing method of elastomer inter-connector with support
JPH0736349B2 (en) * 1991-06-28 1995-04-19 信越ポリマー株式会社 Elastic connector manufacturing method
JP2784371B2 (en) * 1992-03-27 1998-08-06 信越ポリマー株式会社 Manufacturing method of interconnector with eccentric type support
JP3063839B2 (en) * 1997-11-18 2000-07-12 日本電気株式会社 Mounting structure and mounting method of mounted components
TWI434119B (en) * 2006-06-28 2014-04-11 Creator Technology Bv Improved common contact layout for flexible displays
US7766667B2 (en) 2007-12-18 2010-08-03 Russell James V Separable electrical connectors using isotropic conductive elastomer interconnect medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201435A (en) * 1976-07-26 1980-05-06 Shin-Etsu Polymer Co. Ltd. Interconnectors
GB2061632A (en) * 1979-10-03 1981-05-13 Shinetsu Polymer Co Electrical connector of the press-holding type
GB2215661A (en) * 1988-02-15 1989-09-27 Shinetsu Polymer Co Hot-melt adhesive interconnector and method for the preparation thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55100676A (en) * 1979-01-24 1980-07-31 Fujikura Rubber Works Ltd Method of manufacturing conductive connector
JPS58169679U (en) * 1982-05-10 1983-11-12 東レ株式会社 elastic connector
JPS6251111A (en) * 1985-08-29 1987-03-05 日東電工株式会社 Anisotropically conducting film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201435A (en) * 1976-07-26 1980-05-06 Shin-Etsu Polymer Co. Ltd. Interconnectors
GB2061632A (en) * 1979-10-03 1981-05-13 Shinetsu Polymer Co Electrical connector of the press-holding type
GB2215661A (en) * 1988-02-15 1989-09-27 Shinetsu Polymer Co Hot-melt adhesive interconnector and method for the preparation thereof

Also Published As

Publication number Publication date
GB8916322D0 (en) 1989-08-31
JPH0222578U (en) 1990-02-15
JPH0615429Y2 (en) 1994-04-20
GB2222327A (en) 1990-02-28
KR900002493A (en) 1990-02-28
KR950004369B1 (en) 1995-04-28

Similar Documents

Publication Publication Date Title
US5277972B1 (en) Adhesive tapes
GB2215661B (en) Hot-melt adhesive interconnector and method for the preparation thereof
GB8810701D0 (en) Hot-melt polyurethane adhesive compositions
ZA894319B (en) Pressure-sensitive adhesive
EP0335645A3 (en) Adhesive composition
ZA894874B (en) Pressure-sensitive adhesives
IL92863A0 (en) Coated adhesive tablets
AU543796B2 (en) Hot-melt adhesive
AU587284B2 (en) Hot-melt adhesive
GB8610992D0 (en) Adhesive connection
ZA895979B (en) A pregellable adhesive
ZA892835B (en) Pressure-sensitive adhesive
GB2223498B (en) Adhesives
GB2222327B (en) Hot-melt adhesive interconnector
EP0300821A3 (en) Organopolysiloxane hot-melt adhesive
GB2218104B (en) Adhesive compositions
GB2226567B (en) Adhesive composition
GB8829524D0 (en) Hot-melt glue-stocks
EP0518067A3 (en) Reactive hot-melt adhesive
GB8819138D0 (en) Adhesive-coated substrates
AU3306089A (en) Hot-melt adhesive composition
GB2188258B (en) Improvements in hot-melt adhesive applicators
AU3036889A (en) Adhesive member
AU5174585A (en) Hot-melt foamed adhesive
EP0331002B1 (en) Reactive adhesive system

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020717