JPH0222552B2 - - Google Patents
Info
- Publication number
- JPH0222552B2 JPH0222552B2 JP24862784A JP24862784A JPH0222552B2 JP H0222552 B2 JPH0222552 B2 JP H0222552B2 JP 24862784 A JP24862784 A JP 24862784A JP 24862784 A JP24862784 A JP 24862784A JP H0222552 B2 JPH0222552 B2 JP H0222552B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- enamel
- metal
- hollow
- enameled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 22
- 239000007769 metal material Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 210000003298 dental enamel Anatomy 0.000 description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24862784A JPS61128592A (ja) | 1984-11-27 | 1984-11-27 | ホ−ロ−絶縁金属基板の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24862784A JPS61128592A (ja) | 1984-11-27 | 1984-11-27 | ホ−ロ−絶縁金属基板の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61128592A JPS61128592A (ja) | 1986-06-16 |
| JPH0222552B2 true JPH0222552B2 (enrdf_load_stackoverflow) | 1990-05-18 |
Family
ID=17180924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24862784A Granted JPS61128592A (ja) | 1984-11-27 | 1984-11-27 | ホ−ロ−絶縁金属基板の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61128592A (enrdf_load_stackoverflow) |
-
1984
- 1984-11-27 JP JP24862784A patent/JPS61128592A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61128592A (ja) | 1986-06-16 |
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