JPH0222024B2 - - Google Patents

Info

Publication number
JPH0222024B2
JPH0222024B2 JP57169048A JP16904882A JPH0222024B2 JP H0222024 B2 JPH0222024 B2 JP H0222024B2 JP 57169048 A JP57169048 A JP 57169048A JP 16904882 A JP16904882 A JP 16904882A JP H0222024 B2 JPH0222024 B2 JP H0222024B2
Authority
JP
Japan
Prior art keywords
diffusion bonding
bonding
ceramics
insert material
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57169048A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5957972A (ja
Inventor
Kenji Yamane
Yoshiki Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shin Meiva Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Meiva Industry Ltd filed Critical Shin Meiva Industry Ltd
Priority to JP16904882A priority Critical patent/JPS5957972A/ja
Publication of JPS5957972A publication Critical patent/JPS5957972A/ja
Publication of JPH0222024B2 publication Critical patent/JPH0222024B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP16904882A 1982-09-27 1982-09-27 拡散接合方法 Granted JPS5957972A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16904882A JPS5957972A (ja) 1982-09-27 1982-09-27 拡散接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16904882A JPS5957972A (ja) 1982-09-27 1982-09-27 拡散接合方法

Publications (2)

Publication Number Publication Date
JPS5957972A JPS5957972A (ja) 1984-04-03
JPH0222024B2 true JPH0222024B2 (US20050075337A1-20050407-C00081.png) 1990-05-17

Family

ID=15879352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16904882A Granted JPS5957972A (ja) 1982-09-27 1982-09-27 拡散接合方法

Country Status (1)

Country Link
JP (1) JPS5957972A (US20050075337A1-20050407-C00081.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3663516D1 (en) * 1985-05-24 1989-06-29 Kernforschungsanlage Juelich Method of bonding silicon carbide bodies
JPH06105722B2 (ja) * 1985-10-14 1994-12-21 株式会社日立製作所 セラミック接合方法及びセラミックパッケージの製法及びセラミックパッケージ
US4884737A (en) * 1987-05-21 1989-12-05 Lanxide Technology Company, Lp Method for surface bonding of ceramic bodies
US4961529A (en) * 1987-12-24 1990-10-09 Kernforschungsanlage Julich Gmbh Method and components for bonding a silicon carbide molded part to another such part or to a metallic part
JP5809884B2 (ja) * 2011-08-30 2015-11-11 美濃窯業株式会社 炭化ホウ素含有セラミックス接合体及び該接合体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4948707A (US20050075337A1-20050407-C00081.png) * 1972-05-03 1974-05-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4948707A (US20050075337A1-20050407-C00081.png) * 1972-05-03 1974-05-11

Also Published As

Publication number Publication date
JPS5957972A (ja) 1984-04-03

Similar Documents

Publication Publication Date Title
EP0135937B1 (en) Method of bonding alumina to metal
US4448605A (en) Ductile brazing alloys containing reactive metals
JPH0562034B2 (US20050075337A1-20050407-C00081.png)
JPS6140624B2 (US20050075337A1-20050407-C00081.png)
US4715525A (en) Method of bonding columbium to titanium and titanium based alloys using low bonding pressures and temperatures
JP3525348B2 (ja) 拡散接合されたスパッタリングターゲット組立体の製造方法
JPH0222024B2 (US20050075337A1-20050407-C00081.png)
JPH0788262B2 (ja) 窒化ケイ素と金属との接合方法
JPS62289396A (ja) セラミツクスの接合方法
JPH0520392B2 (US20050075337A1-20050407-C00081.png)
JP3469261B2 (ja) 拡散接合されたスパッタリングターゲット組立体及びその製造方法
JPS58135180A (ja) 拡散接合方法
JP4151859B2 (ja) スパッタリング用ターゲット板の接合方法
JPH0940476A (ja) アルミニウム合金部材とセラミックス部材との接合体
JPS5931433B2 (ja) TiとAlあるいはAl合金との接合方法
JPH0329029B2 (US20050075337A1-20050407-C00081.png)
JPS6026633A (ja) 接合用インサ−ト合金
JPH01111783A (ja) 炭素とセラミックス、炭素又は金属との接合構造
JP3153872B2 (ja) 金属−窒化物系セラミックスの接合構造
JP3100022B2 (ja) インサート材料を用いた固相拡散接合法
JPH05213677A (ja) 銅板とアルミナあるいはAlN基板の接合方法
JPH0725677A (ja) セラミックスとニッケル又はニッケル系合金との接合方 法
JPH06321647A (ja) セラミックスとニッケルとの接合方法
JPS60166275A (ja) セラミツクスと金属との接合方法
JPS58135783A (ja) 拡散接合方法