JPH02215189A - フレキシブルプリント回路用基板の製造方法 - Google Patents

フレキシブルプリント回路用基板の製造方法

Info

Publication number
JPH02215189A
JPH02215189A JP1036826A JP3682689A JPH02215189A JP H02215189 A JPH02215189 A JP H02215189A JP 1036826 A JP1036826 A JP 1036826A JP 3682689 A JP3682689 A JP 3682689A JP H02215189 A JPH02215189 A JP H02215189A
Authority
JP
Japan
Prior art keywords
film
vacuum
conductive layer
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1036826A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0561793B2 (enExample
Inventor
Hisao Matsuura
松浦　久雄
Yasuo Iijima
飯島　康男
Kazuo Iwaoka
和男 岩岡
Hiroyuki Muto
博之 武藤
Toshiyuki Inagaki
稲垣　俊幸
Yoshihiko Chiba
義彦 千葉
Junichi Niiyama
新山　淳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1036826A priority Critical patent/JPH02215189A/ja
Publication of JPH02215189A publication Critical patent/JPH02215189A/ja
Publication of JPH0561793B2 publication Critical patent/JPH0561793B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP1036826A 1989-02-15 1989-02-15 フレキシブルプリント回路用基板の製造方法 Granted JPH02215189A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1036826A JPH02215189A (ja) 1989-02-15 1989-02-15 フレキシブルプリント回路用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1036826A JPH02215189A (ja) 1989-02-15 1989-02-15 フレキシブルプリント回路用基板の製造方法

Publications (2)

Publication Number Publication Date
JPH02215189A true JPH02215189A (ja) 1990-08-28
JPH0561793B2 JPH0561793B2 (enExample) 1993-09-07

Family

ID=12480552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1036826A Granted JPH02215189A (ja) 1989-02-15 1989-02-15 フレキシブルプリント回路用基板の製造方法

Country Status (1)

Country Link
JP (1) JPH02215189A (enExample)

Also Published As

Publication number Publication date
JPH0561793B2 (enExample) 1993-09-07

Similar Documents

Publication Publication Date Title
JP5392732B2 (ja) 銅表面の対樹脂接着層、配線基板および接着層形成方法
US6824827B2 (en) Method of making a polyimide film having a thin metal layer
US4383003A (en) Transfer lamination of copper thin sheets and films, method and product
JPH0382750A (ja) ポリイミド基体の少なくとも１面の変性方法
JP3641632B1 (ja) 導電性シート、それを用いた製品およびその製造方法
US6340518B1 (en) Flexible metal-clad laminates and preparation of the same
JP2620573B2 (ja) 電子パッケージ製造方法
GB2091634A (en) Transfer lamination of vapour deposited copper thin sheets and films
JPH05102630A (ja) キヤリア付銅箔の製造方法及びそれを用いた銅張積層板
JP3265027B2 (ja) 金属膜付きポリイミドフィルム
JP3037519B2 (ja) 導電性積層フィルムおよびその製造方法
JPH0561793B2 (enExample)
JPH02209797A (ja) フレキシブルプリント回路用基板の製造方法
JP2574535B2 (ja) 銅ポリイミド基板の製造方法
JP3305770B2 (ja) 金属膜付きポリイミドフィルム
JP4279606B2 (ja) フィルムめっき材料の製造方法及び製造装置
JP4776217B2 (ja) 銅メタライズド積層板及びその製造方法
JPH01214096A (ja) フレキシブルプリント回路基板の製造方法
JPH08227623A (ja) 透明導電性フィルムの製造方法
JPS63303730A (ja) 金属薄膜蒸着ポリエ−テルイミドフィルム
JPH11193461A (ja) 銅層を有する基材の製造方法
JPH01318281A (ja) フレキシブル印刷配線基板の製造方法
JPS6031918B2 (ja) フレキシブル銅張板の製造法
JPH0360181A (ja) フレキシブルプリント配線基板
JP2004103504A (ja) 導電性シート

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees