JPH0220860Y2 - - Google Patents
Info
- Publication number
- JPH0220860Y2 JPH0220860Y2 JP8152084U JP8152084U JPH0220860Y2 JP H0220860 Y2 JPH0220860 Y2 JP H0220860Y2 JP 8152084 U JP8152084 U JP 8152084U JP 8152084 U JP8152084 U JP 8152084U JP H0220860 Y2 JPH0220860 Y2 JP H0220860Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- terminals
- flexible printed
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152084U JPS60194377U (ja) | 1984-06-01 | 1984-06-01 | フレキシブル印刷回路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152084U JPS60194377U (ja) | 1984-06-01 | 1984-06-01 | フレキシブル印刷回路板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60194377U JPS60194377U (ja) | 1985-12-24 |
| JPH0220860Y2 true JPH0220860Y2 (zh) | 1990-06-06 |
Family
ID=30628377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8152084U Granted JPS60194377U (ja) | 1984-06-01 | 1984-06-01 | フレキシブル印刷回路板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60194377U (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950500B2 (ja) * | 2006-02-06 | 2012-06-13 | キヤノン株式会社 | プリント配線基板の接合構造 |
-
1984
- 1984-06-01 JP JP8152084U patent/JPS60194377U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60194377U (ja) | 1985-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0220860Y2 (zh) | ||
| JP2000165034A (ja) | フレキシブルプリント配線板及びその接続方法 | |
| JPH0528066U (ja) | 多層基板とフレキシブル基板との取付構造 | |
| JPH0423322Y2 (zh) | ||
| JP2004327605A (ja) | プリント基板の接続構造 | |
| JP2503911B2 (ja) | プリント配線板 | |
| JPH0442937Y2 (zh) | ||
| JP3959883B2 (ja) | 回路基板の接続構造 | |
| JPH0445253Y2 (zh) | ||
| JPH0423321Y2 (zh) | ||
| JP3606530B2 (ja) | プリント配線板 | |
| JPH0735413Y2 (ja) | 混成集積回路におけるチツプ電子部品の取付構造 | |
| JP2003023244A (ja) | 回路基板 | |
| JPH064605Y2 (ja) | 混成集積回路 | |
| JP2594365B2 (ja) | 配線基板及び配線基板の接続方法 | |
| JPH0429590Y2 (zh) | ||
| JPH0680891B2 (ja) | フレキシブルプリント回路の接続方法 | |
| JPH056715Y2 (zh) | ||
| JPS5910769Y2 (ja) | 抵抗体付き可撓性回路板 | |
| JPH0423323Y2 (zh) | ||
| JPH0426010A (ja) | フラットケーブル | |
| JPH0215587A (ja) | 端子付き回路基板の製造方法 | |
| JPH081977B2 (ja) | 基板の接続構造 | |
| JPH0727649Y2 (ja) | 放熱基板に取り付けられた抵抗体を備えた印刷配線板 | |
| JPH0231794Y2 (zh) |