JPH0219996B2 - - Google Patents

Info

Publication number

JPH0219996B2

JPH0219996B2 JP5930482A JP5930482A JPH0219996B2 JP H0219996 B2 JPH0219996 B2 JP H0219996B2 JP 5930482 A JP5930482 A JP 5930482A JP 5930482 A JP5930482 A JP 5930482A JP H0219996 B2 JPH0219996 B2 JP H0219996B2

Authority

JP

Japan

Prior art keywords

flame

retardant

printed wiring

flexible printed

adhesive

Prior art date

1982-04-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000000853 adhesive Substances 0.000 claims description 46
• 230000001070 adhesive effect Effects 0.000 claims description 46
• RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 44
• 239000003063 flame retardant Substances 0.000 claims description 44
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
• 239000011889 copper foil Substances 0.000 claims description 24
• 239000003822 epoxy resin Substances 0.000 claims description 13
• 229920000647 polyepoxide Polymers 0.000 claims description 13
• 238000004519 manufacturing process Methods 0.000 claims description 10
• 238000000034 method Methods 0.000 claims description 10
• 150000002366 halogen compounds Chemical class 0.000 claims description 8
• WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
• 239000004677 Nylon Substances 0.000 claims description 5
• 229920000800 acrylic rubber Polymers 0.000 claims description 5
• 229920001778 nylon Polymers 0.000 claims description 5
• 229920000058 polyacrylate Polymers 0.000 claims description 5
• 229920001187 thermosetting polymer Polymers 0.000 claims description 4
• 238000010438 heat treatment Methods 0.000 claims description 3
• 238000010030 laminating Methods 0.000 claims description 3
• 239000007787 solid Substances 0.000 claims description 2
• 238000001035 drying Methods 0.000 claims 1
• 238000003825 pressing Methods 0.000 claims 1
• 239000010410 layer Substances 0.000 description 23
• 230000032683 aging Effects 0.000 description 15
• 239000000203 mixture Substances 0.000 description 11
• LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
• XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
• 229920001721 polyimide Polymers 0.000 description 9
• 229910052802 copper Inorganic materials 0.000 description 7
• 239000010949 copper Substances 0.000 description 7
• 239000000126 substance Substances 0.000 description 7
• 239000003795 chemical substances by application Substances 0.000 description 6
• 230000000052 comparative effect Effects 0.000 description 6
• 238000005260 corrosion Methods 0.000 description 5
• 230000007797 corrosion Effects 0.000 description 5
• 229910052736 halogen Inorganic materials 0.000 description 5
• 150000002367 halogens Chemical class 0.000 description 5
• 238000009472 formulation Methods 0.000 description 4
• 229920005989 resin Polymers 0.000 description 4
• 239000011347 resin Substances 0.000 description 4
• NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
• JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
• 239000012790 adhesive layer Substances 0.000 description 3
• CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
• QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
• PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 3
• SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
• XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
• NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 2
• BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
• 239000006087 Silane Coupling Agent Substances 0.000 description 2
• XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
• 150000008064 anhydrides Chemical class 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 238000010292 electrical insulation Methods 0.000 description 2
• 239000011888 foil Substances 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
• 229910000077 silane Inorganic materials 0.000 description 2
• 239000000758 substrate Substances 0.000 description 2
• HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
• 239000004642 Polyimide Substances 0.000 description 1
• 239000002318 adhesion promoter Substances 0.000 description 1
• 230000002411 adverse Effects 0.000 description 1
• 150000001413 amino acids Chemical class 0.000 description 1
• 238000013459 approach Methods 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 230000033228 biological regulation Effects 0.000 description 1
• 125000001246 bromo group Chemical group Br* 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 230000002596 correlated effect Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 230000005764 inhibitory process Effects 0.000 description 1
• 239000003960 organic solvent Substances 0.000 description 1
• 239000000049 pigment Substances 0.000 description 1
• 229920000728 polyester Polymers 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 229920003002 synthetic resin Polymers 0.000 description 1
• 239000000057 synthetic resin Substances 0.000 description 1
• DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1