JPH0219989B2 - - Google Patents
Info
- Publication number
- JPH0219989B2 JPH0219989B2 JP9665282A JP9665282A JPH0219989B2 JP H0219989 B2 JPH0219989 B2 JP H0219989B2 JP 9665282 A JP9665282 A JP 9665282A JP 9665282 A JP9665282 A JP 9665282A JP H0219989 B2 JPH0219989 B2 JP H0219989B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- electrically insulating
- synthetic resin
- insulating substrate
- electrical insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 20
- 239000004744 fabric Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009503 electrostatic coating Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 101000601394 Homo sapiens Neuroendocrine convertase 2 Proteins 0.000 description 1
- 102100037732 Neuroendocrine convertase 2 Human genes 0.000 description 1
- -1 SiC Chemical class 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9665282A JPS58213493A (ja) | 1982-06-04 | 1982-06-04 | 電気絶縁基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9665282A JPS58213493A (ja) | 1982-06-04 | 1982-06-04 | 電気絶縁基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58213493A JPS58213493A (ja) | 1983-12-12 |
| JPH0219989B2 true JPH0219989B2 (US06373033-20020416-M00035.png) | 1990-05-07 |
Family
ID=14170757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9665282A Granted JPS58213493A (ja) | 1982-06-04 | 1982-06-04 | 電気絶縁基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58213493A (US06373033-20020416-M00035.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0793068B2 (ja) * | 1984-09-06 | 1995-10-09 | 鐘淵化学工業株式会社 | 高絶縁性基板の製法 |
| JPS6173141U (US06373033-20020416-M00035.png) * | 1984-10-19 | 1986-05-17 | ||
| JP6027941B2 (ja) * | 2013-05-14 | 2016-11-16 | 株式会社ノリタケカンパニーリミテド | 金属接合部品および金属用接合材 |
-
1982
- 1982-06-04 JP JP9665282A patent/JPS58213493A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58213493A (ja) | 1983-12-12 |
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