JPH0219972Y2 - - Google Patents
Info
- Publication number
- JPH0219972Y2 JPH0219972Y2 JP1982134105U JP13410582U JPH0219972Y2 JP H0219972 Y2 JPH0219972 Y2 JP H0219972Y2 JP 1982134105 U JP1982134105 U JP 1982134105U JP 13410582 U JP13410582 U JP 13410582U JP H0219972 Y2 JPH0219972 Y2 JP H0219972Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- flexible substrate
- connector
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 36
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
本考案はIC又はLSI等の集積回路を塔載するた
めのボードに関するものである。[Detailed Description of the Invention] The present invention relates to a board for mounting an integrated circuit such as an IC or an LSI.
例えば、マイコンを応用したテレビゲーム等に
於いて、そのゲーム内容を決定するソフトウエア
（プログラム）が収納されているROM及びこれ
を制御するCPU等は通常のプリントサーキツト
ボードに他のコンデンサ、チツプ等とともに塔載
され、このボードが他の周辺機器と共に組み込ま
れてテレビゲームが構成されている。然るに、こ
のような形態であるとプリントサーキツトボード
からROM及びCPU等が露出しているためそのソ
フトウエアが多大の労力と時間が費やされて完成
されたものであるにもかかわらず簡単にコピーさ
れてしまい、しかも現在このようなソフトウエア
の盗用を取り締まる有効な法的手段がなく、その
コピー防止対策が大きな問題となつている。 For example, in a video game that uses a microcomputer, the ROM that stores the software (program) that determines the game content and the CPU that controls it are mounted on a regular printed circuit board with other capacitors and chips. etc., and this board is incorporated with other peripheral equipment to create a video game. However, in this form, the ROM, CPU, etc. are exposed from the printed circuit board, so even though the software has been completed with a great deal of effort and time, it can be easily However, there are currently no effective legal means to control the plagiarism of such software, and countermeasures to prevent copying have become a major problem.
従つて、本考案の目的とするところはROM，
RAM或はCPU等の集積回路を１個若しくは複数
個塔載し、これら集積回路に収納されているプロ
グラムのコピーを良好に防止し得るボードを提供
することにある。 Therefore, the purpose of this invention is ROM,
The object of the present invention is to provide a board on which one or more integrated circuits such as RAM or CPU are mounted, and which can effectively prevent programs stored in these integrated circuits from being copied.
プログラムのコピーを防止する手段として、ソ
フトウエアにセキユリテイをかけるものとハード
的に防止するものの２種類があるが本考案は後者
に属するものである。 There are two types of means for preventing copying of programs: one that applies security to software and one that uses hardware to prevent copying, and the present invention belongs to the latter.
本考案の概要を述べれば、コネクター用の接続
端子が設けられたボード基板上に集積回路を配し
たフレキシブル基板が載置され、このフレキシブ
ル基板の端子とボード基板のコネクター用の接続
端子とが電気的に接続され、さらにボード基板及
びフレキシブル基板の上面が合成樹脂により被覆
されてなる集積回路を有するボードである。 To summarize the invention, a flexible substrate on which an integrated circuit is arranged is placed on a board provided with connection terminals for a connector, and the terminals on the flexible substrate and the connection terminals for the connector on the board are connected electrically. This board has an integrated circuit that is connected to the flexible substrate, and the upper surfaces of the board substrate and the flexible substrate are covered with synthetic resin.
以下に本考案を図面の実施例に基づき詳細に説
明する。 The present invention will be explained in detail below based on the embodiments shown in the drawings.
第１図は本考案にかかるボードの断面図、第２
図は一部破断平面図である。 Figure 1 is a cross-sectional view of the board according to the present invention, Figure 2 is a cross-sectional view of the board according to the present invention.
The figure is a partially cutaway plan view.
ボード基板１は塩化ビニル、エポキシ、ポリエ
チレン等の各種合成樹脂、シート、或は紙−フエ
ノール、紙−エポキシ、ガラス−エポキシ等の各
種材料と合成樹脂の混成シート等をその素材とし
て用いることができる。 The board substrate 1 can be made of various synthetic resins such as vinyl chloride, epoxy, polyethylene, sheets, or composite sheets of synthetic resins and various materials such as paper-phenol, paper-epoxy, glass-epoxy, etc. .
このようなボード基板１の一辺にはこのボード
を電気的に他の機器と接続するためのコネクター
に挿し込むコネクター用突出部２が形成されてい
る。コネクター用突出部２の表面にはコネクター
用端子２１が設けられている。このコネクター用
端子２１は通常のプリントサーキツトボードに設
けられているものと同様のものでよく、蒸着によ
り設けられた銅層をエツチングして所望のパター
ン状に形成し、さらにこの表面に金メツキを施し
たものである。 A connector protrusion 2 is formed on one side of the board 1 to be inserted into a connector for electrically connecting the board to other equipment. A connector terminal 21 is provided on the surface of the connector protrusion 2 . The connector terminals 21 may be similar to those provided on ordinary printed circuit boards, and are formed by etching a copper layer provided by vapor deposition to form a desired pattern, and then gold plating the surface. It has been subjected to
このようなボード基板１表面にプログラム等の
固有の情報が記録されているROM或はそのシス
テムの動きを制御するCPU等の集積回路が配さ
れたフレキシブル基板２２が載置され、かつその
端子２３がコネクター用端子２１に溶接等の手段
により接続される。必要であればフレキシブル基
板２２をボード基板１に適当な接着剤を介して接
着しておいても良い。またボード基板１の表面は
後述する被覆用合成樹脂１１を一体化する関係上
フレキシブル基板２２により全面は覆われず、か
なりの部分が露出する必要がある。被覆材１１は
フレキシブル基板２２をボード基板１と一体とな
つてサンドイツチ状に挾持するものである。この
ような被覆材１１の素材としては塩化ビニル、ポ
リエチレン、ポリスチレン、アクリル等の熱可塑
性合成樹脂、フエノール樹脂、エポキシ樹脂等の
熱硬化性樹脂等の合成樹脂を用いることができ
る。被覆材１１の素材として熱可塑性合成樹脂を
用いた場合、予めこの素材を突出部２を除くボー
ド基板１とほぼ同一の大きさのシート状に形成
し、これをボード基板１表面に重ね合わせて加熱
加圧する。これにより、被覆材１１は溶融しボー
ド基板１表面及びフレキシブル基板２２表面に溶
着し、被覆材１１はフレキシブル基板２２を内蔵
する形でボード基板１と一体となり本考案のボー
ドが完成する。なお、被覆材１１とボード基板１
及びフレキシブル基板２２との間に接着剤、例え
ば加熱再活性型の接着剤を介在させて両者を一体
化しても良い。これらの場合、ROM，CPU等の
集積回路はフレキシブル基板２２から突出してい
るため被覆材１１に埋まり込んだ形となる。ま
た、予め集積回路の嵌まり込む凹部を形成してお
いても良い。 On the surface of such a board 1, there is placed a flexible substrate 22 on which a ROM in which specific information such as programs is recorded or an integrated circuit such as a CPU that controls the operation of the system is arranged, and its terminals 23 is connected to the connector terminal 21 by means such as welding. If necessary, the flexible substrate 22 may be bonded to the board substrate 1 with a suitable adhesive. Further, the surface of the board substrate 1 is not entirely covered by the flexible substrate 22 in order to integrate the coating synthetic resin 11 described later, and a considerable portion needs to be exposed. The covering material 11 is for holding the flexible substrate 22 together with the board substrate 1 in a sandwich-like structure. As a material for such a covering material 11, synthetic resins such as thermoplastic synthetic resins such as vinyl chloride, polyethylene, polystyrene, and acrylic, and thermosetting resins such as phenol resins and epoxy resins can be used. When a thermoplastic synthetic resin is used as the material for the covering material 11, this material is formed in advance into a sheet having approximately the same size as the board substrate 1 excluding the protruding portion 2, and this is superimposed on the surface of the board substrate 1. Heat and pressurize. As a result, the covering material 11 is melted and welded to the surface of the board substrate 1 and the flexible substrate 22, and the covering material 11 is integrated with the board substrate 1 with the flexible substrate 22 built therein, thereby completing the board of the present invention. In addition, the covering material 11 and the board substrate 1
An adhesive, such as a heat-reactivated adhesive, may be interposed between the flexible substrate 22 and the flexible substrate 22 to integrate the two. In these cases, integrated circuits such as the ROM and CPU protrude from the flexible substrate 22 and are therefore embedded in the covering material 11. Alternatively, a recess into which the integrated circuit fits may be formed in advance.
他方、熱硬化性合成樹脂を被覆材１１の素材と
して用いた場合には、適当な方法によりこの樹脂
をボード基板１及びフレキシブル基板２２表面を
完全に被うように塗布し、これを加熱することに
より樹脂が硬化してボード基板１と一体となり、
これによりフレキシブル基板２２が内蔵されたボ
ードを得ることができる。 On the other hand, when a thermosetting synthetic resin is used as the material for the covering material 11, the resin is applied by an appropriate method so as to completely cover the surfaces of the board substrate 1 and the flexible substrate 22, and then heated. The resin hardens and becomes integrated with the board substrate 1,
As a result, a board having a built-in flexible substrate 22 can be obtained.
このように被覆材１１をボード基板１と一体化
することによりフレキシブル基板に配された集積
回路は完全にその周囲を樹脂で被覆された形とな
り、個々の集積回路を取り出すことはできず、例
えばROMに記憶されているプログラムはこれを
コピーすることができなくなるものである。 By integrating the covering material 11 with the board substrate 1 in this way, the integrated circuits arranged on the flexible substrate are completely covered with resin, and individual integrated circuits cannot be taken out, for example. Programs stored in ROM cannot be copied.
以上に述べたように本考案によれば、ソフトウ
エアが格納されているROM等の集積回路を完全
に被覆することができ、そのソフトウエアのコピ
ーを良好に防止することができるものである。 As described above, according to the present invention, it is possible to completely cover an integrated circuit such as a ROM in which software is stored, and it is possible to effectively prevent copying of the software.
第１図は本考案にかかるボードの断面図、第２
図は一部破断平面図である。
１……ボード基板、２……コネクター用突出
部、１１……被覆材、２１……コネクター用接続
端子、２２……フレキシブル基板、２３……配線
端子、２４……CPU、２５……ROM。
Figure 1 is a cross-sectional view of the board according to the present invention, Figure 2 is a cross-sectional view of the board according to the present invention.
The figure is a partially cutaway plan view. DESCRIPTION OF SYMBOLS 1... Board substrate, 2... Connector protrusion, 11... Covering material, 21... Connector connection terminal, 22... Flexible board, 23... Wiring terminal, 24... CPU, 25... ROM.
Claims (1)
板上に集積回路を配したフレキシブル基板が載置
され、このフレキシブル基板の端子とボード基板
のコネクター用の接続端子とが電気的に接続さ
れ、さらにボード基板及びフレキシブル基板の上
面が合成樹脂により被覆されてなる集積回路塔載
ボード。 A flexible substrate on which an integrated circuit is arranged is placed on a board substrate provided with connection terminals for the connector, and the terminals of the flexible substrate and the connection terminals for the connector on the board substrate are electrically connected, and then the board substrate is and an integrated circuit mounting board comprising a flexible substrate whose upper surface is covered with synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13410582U JPS5937737U (en) | 1982-09-03 | 1982-09-03 | integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13410582U JPS5937737U (en) | 1982-09-03 | 1982-09-03 | integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5937737U JPS5937737U (en) | 1984-03-09 |
| JPH0219972Y2 true JPH0219972Y2 (en) | 1990-05-31 |
Family
ID=30302274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13410582U Granted JPS5937737U (en) | 1982-09-03 | 1982-09-03 | integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5937737U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2547565B2 (en) * | 1987-04-17 | 1996-10-23 | 三洋電機株式会社 | Manufacturing method of hybrid integrated circuit |
| JP2503984Y2 (en) * | 1987-04-17 | 1996-07-03 | 三洋電機株式会社 | Hybrid integrated circuit |
| JP4626289B2 (en) * | 2004-12-14 | 2011-02-02 | 株式会社デンソー | Electronic device manufacturing method, substrate manufacturing method, electronic device and substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4976242U (en) * | 1972-10-23 | 1974-07-02 |
-
1982
- 1982-09-03 JP JP13410582U patent/JPS5937737U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5937737U (en) | 1984-03-09 |
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