JPS6090868U - printed wiring board equipment - Google Patents

printed wiring board equipment

Info

Publication number
JPS6090868U
JPS6090868U JP18318783U JP18318783U JPS6090868U JP S6090868 U JPS6090868 U JP S6090868U JP 18318783 U JP18318783 U JP 18318783U JP 18318783 U JP18318783 U JP 18318783U JP S6090868 U JPS6090868 U JP S6090868U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
board equipment
electronic element
leadless electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18318783U
Other languages
Japanese (ja)
Inventor
斉藤　典友
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP18318783U priority Critical patent/JPS6090868U/en
Publication of JPS6090868U publication Critical patent/JPS6090868U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案によるプリント配線基板装置の拡大断
面図、第２図は同装置の組立て過程の説明断面図である
。 １０・・・ｐｃ基板、１１・・・基板、１２・・・導パ
ターン、１３・・・リードレス素子、１４・・・接合材
、１５・・・接着剤、１６・・・熱可塑性樹脂フィルム
。FIG. 1 is an enlarged sectional view of a printed wiring board device according to this invention, and FIG. 2 is an explanatory sectional view of the assembly process of the device. DESCRIPTION OF SYMBOLS 10... PC board, 11... Substrate, 12... Conductive pattern, 13... Leadless element, 14... Bonding material, 15... Adhesive, 16... Thermoplastic resin film .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレス電子素子を有するプリント配線基板゛装置に
おいて、導電パターン上に配置されたり一ドレス電子素
子はプリント配線基板と共に、熱可塑性樹脂フィルムで
覆われ、この熱可塑性樹脂フィルムがプリント配線基板
に密着、硬化させられてリードレス電子素子が所定位置
に固定された構成であることを特徴とするプリント配線
基板装置。In a printed wiring board device having a leadless electronic element, the leadless electronic element arranged on a conductive pattern is covered with a thermoplastic resin film together with the printed wiring board, and this thermoplastic resin film is tightly attached to the printed wiring board. A printed wiring board device characterized by having a structure in which a leadless electronic element is fixed in a predetermined position by being cured.
JP18318783U 1983-11-28 1983-11-28 printed wiring board equipment Pending JPS6090868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18318783U JPS6090868U (en) 1983-11-28 1983-11-28 printed wiring board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18318783U JPS6090868U (en) 1983-11-28 1983-11-28 printed wiring board equipment

Publications (1)

Publication Number Publication Date
JPS6090868U true JPS6090868U (en) 1985-06-21

Family

ID=30396525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18318783U Pending JPS6090868U (en) 1983-11-28 1983-11-28 printed wiring board equipment

Country Status (1)

Country Link
JP (1) JPS6090868U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002019783A1 (en) * 2000-08-29 2002-03-07 Fujitsu Limited Circuit board unit and method of manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002019783A1 (en) * 2000-08-29 2002-03-07 Fujitsu Limited Circuit board unit and method of manufacture thereof

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