JPS60113618U - Resin mold type composite circuit parts - Google Patents

Resin mold type composite circuit parts

Info

Publication number
JPS60113618U
JPS60113618U JP64884U JP64884U JPS60113618U JP S60113618 U JPS60113618 U JP S60113618U JP 64884 U JP64884 U JP 64884U JP 64884 U JP64884 U JP 64884U JP S60113618 U JPS60113618 U JP S60113618U
Authority
JP
Japan
Prior art keywords
composite circuit
circuit parts
resin mold
type composite
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP64884U
Other languages
Japanese (ja)
Inventor
裕啓 江原
和彦 高橋
Original Assignee
株式会社　指月電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　指月電機製作所 filed Critical 株式会社　指月電機製作所
Priority to JP64884U priority Critical patent/JPS60113618U/en
Publication of JPS60113618U publication Critical patent/JPS60113618U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の複合回路部品のｉ例を示す斜視図、第２
図はこの考案の樹脂モールド形複合回路部品の一実施例
の外観斜視図である。 １・・・プリント基盤、７・・・リード線、９・・・樹
脂被覆、１０・・・樹脂モールド形複合回路部品。Figure 1 is a perspective view showing an example of a conventional composite circuit component.
The figure is an external perspective view of one embodiment of the resin-molded composite circuit component of this invention. DESCRIPTION OF SYMBOLS 1...Printed board, 7...Lead wire, 9...Resin coating, 10...Resin mold type composite circuit component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基盤上に、複数の電子部品より成る単位回路を
装着、結線すると共に、このプリント基盤の全体に樹脂
被覆を施し、上記プ・リント基盤から外方へとリード線
を導出したことを特徴とする樹脂モールド形複合回路部
品。A unit circuit consisting of a plurality of electronic components is mounted and wired on a printed circuit board, the entire printed circuit board is coated with resin, and lead wires are led out from the printed circuit board. Resin molded composite circuit parts.
JP64884U 1984-01-06 1984-01-06 Resin mold type composite circuit parts Pending JPS60113618U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP64884U JPS60113618U (en) 1984-01-06 1984-01-06 Resin mold type composite circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP64884U JPS60113618U (en) 1984-01-06 1984-01-06 Resin mold type composite circuit parts

Publications (1)

Publication Number Publication Date
JPS60113618U true JPS60113618U (en) 1985-08-01

Family

ID=30472678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP64884U Pending JPS60113618U (en) 1984-01-06 1984-01-06 Resin mold type composite circuit parts

Country Status (1)

Country Link
JP (1) JPS60113618U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247065A (en) * 2003-02-10 2004-09-02 Rinnai Corp Control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247065A (en) * 2003-02-10 2004-09-02 Rinnai Corp Control device

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