JPS6025131U - Resin dipped capacitor - Google Patents
Resin dipped capacitorInfo
- Publication number
- JPS6025131U JPS6025131U JP11526183U JP11526183U JPS6025131U JP S6025131 U JPS6025131 U JP S6025131U JP 11526183 U JP11526183 U JP 11526183U JP 11526183 U JP11526183 U JP 11526183U JP S6025131 U JPS6025131 U JP S6025131U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- capacitor
- resin dipped
- dipped capacitor
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂ティップ型コンデンサの正面図、第
２図は第１図の樹脂ディップ型コンデンサを印刷配線板
に接続した状態の断面図、第３図は本考案の実施例の正
面断面図、第４図は本考案の実施例を印刷配線板に接続
した状態の断面図を示す。
１１・・・・・・コンデンサ素子、１３ａ、１３ｂ・・
・・・・リード線、１４・・・・・・樹脂外装、１５・
・・・・・突出部、１６・・・・・・コンデンサ。Figure 1 is a front view of a conventional resin-tip capacitor, Figure 2 is a cross-sectional view of the resin-dipped capacitor shown in Figure 1 connected to a printed wiring board, and Figure 3 is a front cross-section of an embodiment of the present invention. FIG. 4 shows a cross-sectional view of an embodiment of the present invention connected to a printed wiring board. 11...Capacitor element, 13a, 13b...
...Lead wire, 14...Resin sheath, 15.
...Protruding part, 16... Capacitor.
Claims (1)
ンサにおいて、リード線引き出し側の樹脂外装がＲ状に
突出していることを特徴とする樹脂ディップ型コンデン
サ。A resin dipped capacitor in which lead wires are drawn out in the same direction, and the resin casing on the lead wire drawing side protrudes in an R shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526183U JPS6025131U (en) | 1983-07-25 | 1983-07-25 | Resin dipped capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526183U JPS6025131U (en) | 1983-07-25 | 1983-07-25 | Resin dipped capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6025131U true JPS6025131U (en) | 1985-02-20 |
Family
ID=30266129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11526183U Pending JPS6025131U (en) | 1983-07-25 | 1983-07-25 | Resin dipped capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025131U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100461A (en) * | 1977-02-14 | 1978-09-01 | Nippon Electric Co | Method of packing electronic parts |
| JPS5661115A (en) * | 1979-10-25 | 1981-05-26 | Matsushita Electric Ind Co Ltd | Method of manufacturing resin molded condenser |
| JPS5713734A (en) * | 1980-06-30 | 1982-01-23 | Nichicon Capacitor Ltd | Capacitor |
-
1983
- 1983-07-25 JP JP11526183U patent/JPS6025131U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53100461A (en) * | 1977-02-14 | 1978-09-01 | Nippon Electric Co | Method of packing electronic parts |
| JPS5661115A (en) * | 1979-10-25 | 1981-05-26 | Matsushita Electric Ind Co Ltd | Method of manufacturing resin molded condenser |
| JPS5713734A (en) * | 1980-06-30 | 1982-01-23 | Nichicon Capacitor Ltd | Capacitor |
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