JPS6020670U - integrated circuit card - Google Patents
integrated circuit cardInfo
- Publication number
- JPS6020670U JPS6020670U JP11001583U JP11001583U JPS6020670U JP S6020670 U JPS6020670 U JP S6020670U JP 11001583 U JP11001583 U JP 11001583U JP 11001583 U JP11001583 U JP 11001583U JP S6020670 U JPS6020670 U JP S6020670U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- protective film
- insulating layer
- circuit card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案の集積回路カードの一実施例を示す平
面図、第２図は第１図のＡ−Ａ断面図である。
１０・・・基板、１１・・・配線パターン、１２・・・
集積回路チップ、１３・・・リード線、１４・・・端子
部、１５・・・スルーホールンツキ、１６・・・プラス
チックシート、１７・・・樹脂パック、１８．１９・・
・プラスチックフィルム。FIG. 1 is a plan view showing an embodiment of the integrated circuit card of this invention, and FIG. 2 is a sectional view taken along the line AA in FIG. 10... Board, 11... Wiring pattern, 12...
Integrated circuit chip, 13...Lead wire, 14...Terminal part, 15...Through hole mounting, 16...Plastic sheet, 17...Resin pack, 18.19...
・Plastic film.
Claims (1)
ッキ層を介して前記配線パターンに接続される入出力端
子部が形成された基板と、該基板上に載置された前記配
置パターンに接続される集積回路チップと、該集積回路
チップの載置部に孔が形成されかつ該集積回路の厚さよ
りも少（とも厚い厚さを有し前記基板上に積層される絶
縁体層と、前記集積回路チップを固定するために前記孔
の空隙部に充填される充填材と、前記絶縁体層の上面を
被覆する第１の保護膜と、前記基板の下面を前記入出力
端子部を除いて被覆する第２の保護膜とからなる集積回
路カード。A substrate having a wiring pattern formed on its front surface and an input/output terminal portion connected to the wiring pattern via a through-hole plating layer on its back surface, and connected to the arrangement pattern placed on the substrate. an integrated circuit chip, an insulating layer laminated on the substrate, the insulating layer having a hole formed in the mounting portion of the integrated circuit chip and having a thickness less than or greater than the thickness of the integrated circuit; a filler filled in the void of the hole to fix the chip; a first protective film covering the top surface of the insulating layer; and a first protective film covering the bottom surface of the substrate except for the input/output terminals. an integrated circuit card comprising a second protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11001583U JPS6020670U (en) | 1983-07-15 | 1983-07-15 | integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11001583U JPS6020670U (en) | 1983-07-15 | 1983-07-15 | integrated circuit card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6020670U true JPS6020670U (en) | 1985-02-13 |
Family
ID=30256046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11001583U Pending JPS6020670U (en) | 1983-07-15 | 1983-07-15 | integrated circuit card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020670U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248184A (en) * | 1985-04-26 | 1986-11-05 | Kyodo Printing Co Ltd | Ic module |
| KR20210123323A (en) | 2019-02-06 | 2021-10-13 | 닛산 가가쿠 가부시키가이샤 | Curable composition for light-resistant hard coat |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
-
1983
- 1983-07-15 JP JP11001583U patent/JPS6020670U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748175A (en) * | 1980-07-09 | 1982-03-19 | Philips Nv | Portable identifying structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248184A (en) * | 1985-04-26 | 1986-11-05 | Kyodo Printing Co Ltd | Ic module |
| KR20210123323A (en) | 2019-02-06 | 2021-10-13 | 닛산 가가쿠 가부시키가이샤 | Curable composition for light-resistant hard coat |
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