JPH0219197B2 - - Google Patents

Info

Publication number
JPH0219197B2
JPH0219197B2 JP57501165A JP50116582A JPH0219197B2 JP H0219197 B2 JPH0219197 B2 JP H0219197B2 JP 57501165 A JP57501165 A JP 57501165A JP 50116582 A JP50116582 A JP 50116582A JP H0219197 B2 JPH0219197 B2 JP H0219197B2
Authority
JP
Japan
Prior art keywords
palladium
plating
bath
molar
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57501165A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58500289A (ja
Inventor
Josefu Ansonii Abaizu
Haauei Sutewaato Torotsupu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
AT&T Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Technologies Inc filed Critical AT&T Technologies Inc
Publication of JPS58500289A publication Critical patent/JPS58500289A/ja
Publication of JPH0219197B2 publication Critical patent/JPH0219197B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP57501165A 1981-02-27 1982-02-18 パラジウムとパラジウム合金の電気メツキ方法 Granted JPS58500289A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23915181A 1981-02-27 1981-02-27
US239151SEEUS 1981-02-27

Publications (2)

Publication Number Publication Date
JPS58500289A JPS58500289A (ja) 1983-02-24
JPH0219197B2 true JPH0219197B2 (enExample) 1990-04-27

Family

ID=22900832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57501165A Granted JPS58500289A (ja) 1981-02-27 1982-02-18 パラジウムとパラジウム合金の電気メツキ方法

Country Status (7)

Country Link
EP (2) EP0073236B1 (enExample)
JP (1) JPS58500289A (enExample)
CA (1) CA1189016A (enExample)
DE (1) DE3266736D1 (enExample)
GB (1) GB2112018B (enExample)
HK (1) HK48088A (enExample)
WO (1) WO1982002908A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4741818A (en) * 1985-12-12 1988-05-03 Learonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
DE4444232C1 (de) * 1994-07-21 1996-05-09 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
EP0693579B1 (de) * 1994-07-21 1997-08-27 W.C. Heraeus GmbH Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
DE4431847C5 (de) * 1994-09-07 2011-01-27 Atotech Deutschland Gmbh Substrat mit bondfähiger Beschichtung
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
ATE555235T1 (de) * 2008-05-07 2012-05-15 Umicore Galvanotechnik Gmbh Pd- und pd-ni-elektrolytbäder
JP2012241260A (ja) * 2011-05-23 2012-12-10 Kanto Gakuin 電解パラジウム−リン合金めっき液、めっき被膜及びめっき製品
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2452308A (en) * 1946-02-28 1948-10-26 George C Lambros Process of plating palladium and plating bath therefor
CH534215A (fr) * 1971-09-06 1973-02-28 Oxy Metal Finishing Europ S A Bain électrolytique pour l'électrodéposition d'alliages d'or et une utilisation de celui-ci
DE2360834C3 (de) * 1973-12-06 1978-05-18 Inovan-Stroebe Kg, 7534 Birkenfeld Bad und Verfahren zum galvanischen Abscheiden von Palladiumschichten
DE2506467C2 (de) * 1975-02-07 1986-07-17 Schering AG, 1000 Berlin und 4709 Bergkamen Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
DE2939920C2 (de) * 1979-10-02 1982-09-23 W.C. Heraeus Gmbh, 6450 Hanau Verwendung eines Amins in einem Bad zum galvanischen Abscheiden von Palladium
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution

Also Published As

Publication number Publication date
DE3266736D1 (en) 1985-11-14
EP0059452B1 (en) 1985-10-09
EP0073236A4 (en) 1983-01-14
EP0059452A2 (en) 1982-09-08
JPS58500289A (ja) 1983-02-24
EP0073236B1 (en) 1985-10-09
GB2112018A (en) 1983-07-13
WO1982002908A1 (en) 1982-09-02
GB2112018B (en) 1984-08-15
HK48088A (en) 1988-07-08
EP0059452A3 (en) 1982-11-10
CA1189016A (en) 1985-06-18
EP0073236A1 (en) 1983-03-09

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