JPH021862Y2 - - Google Patents

Info

Publication number
JPH021862Y2
JPH021862Y2 JP18727385U JP18727385U JPH021862Y2 JP H021862 Y2 JPH021862 Y2 JP H021862Y2 JP 18727385 U JP18727385 U JP 18727385U JP 18727385 U JP18727385 U JP 18727385U JP H021862 Y2 JPH021862 Y2 JP H021862Y2
Authority
JP
Japan
Prior art keywords
resin
lead
semiconductor device
sealed
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18727385U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6296857U (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18727385U priority Critical patent/JPH021862Y2/ja
Publication of JPS6296857U publication Critical patent/JPS6296857U/ja
Application granted granted Critical
Publication of JPH021862Y2 publication Critical patent/JPH021862Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP18727385U 1985-12-06 1985-12-06 Expired JPH021862Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18727385U JPH021862Y2 (es) 1985-12-06 1985-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18727385U JPH021862Y2 (es) 1985-12-06 1985-12-06

Publications (2)

Publication Number Publication Date
JPS6296857U JPS6296857U (es) 1987-06-20
JPH021862Y2 true JPH021862Y2 (es) 1990-01-17

Family

ID=31137602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18727385U Expired JPH021862Y2 (es) 1985-12-06 1985-12-06

Country Status (1)

Country Link
JP (1) JPH021862Y2 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4167715B1 (ja) * 2007-08-13 2008-10-22 オーナンバ株式会社 ツインチップ搭載型ダイオード

Also Published As

Publication number Publication date
JPS6296857U (es) 1987-06-20

Similar Documents

Publication Publication Date Title
US4095253A (en) Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
CN110429075B (zh) 高密度多侧面引脚外露的封装结构及其生产方法
JPH021862Y2 (es)
JPH03108745A (ja) 半導体装置
JPH0254665B2 (es)
JPH056666Y2 (es)
JPS60129136U (ja) 半導体装置
JPH0735403Y2 (ja) リードフレーム
JPH0529527A (ja) 半導体装置
JPS6350863B2 (es)
JPH0423330Y2 (es)
US20220384362A1 (en) Faraday cage plastic cavity package with pre-molded cavity leadframe
JP3867881B2 (ja) 半導体装置
JPS635239Y2 (es)
JPH0412677Y2 (es)
JPH0739240Y2 (ja) リードフレーム
JPS642440Y2 (es)
JPH0714021B2 (ja) 樹脂封止型半導体装置
JP2597606Y2 (ja) 半導体装置
JPS5812452Y2 (ja) 半導体装置
JPS5826535Y2 (ja) 集積回路装置用多連リ−ドフレ−ム
JP2536568B2 (ja) リ―ドフレ―ム
JPS6018848Y2 (ja) 樹脂モ−ルド型半導体装置用リ−ドフレ−ム
JPS6214705Y2 (es)
JPH0629149U (ja) 樹脂封止型半導体装置