JPH0218612B2 - - Google Patents
Info
- Publication number
- JPH0218612B2 JPH0218612B2 JP15678982A JP15678982A JPH0218612B2 JP H0218612 B2 JPH0218612 B2 JP H0218612B2 JP 15678982 A JP15678982 A JP 15678982A JP 15678982 A JP15678982 A JP 15678982A JP H0218612 B2 JPH0218612 B2 JP H0218612B2
- Authority
- JP
- Japan
- Prior art keywords
- mirror
- substrate
- polishing
- main surface
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 24
- 238000005498 polishing Methods 0.000 claims description 20
- 239000013078 crystal Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 8
- 238000010897 surface acoustic wave method Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 3
- 239000006061 abrasive grain Substances 0.000 description 6
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 4
- 229960002050 hydrofluoric acid Drugs 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- WOETYXKQRPQLCY-UHFFFAOYSA-N [N+](=O)([O-])[C]F Chemical compound [N+](=O)([O-])[C]F WOETYXKQRPQLCY-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15678982A JPS5947822A (ja) | 1982-09-10 | 1982-09-10 | 弾性表面波用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15678982A JPS5947822A (ja) | 1982-09-10 | 1982-09-10 | 弾性表面波用基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5947822A JPS5947822A (ja) | 1984-03-17 |
| JPH0218612B2 true JPH0218612B2 (enExample) | 1990-04-26 |
Family
ID=15635336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15678982A Granted JPS5947822A (ja) | 1982-09-10 | 1982-09-10 | 弾性表面波用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5947822A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017983A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 弾性波装置用ウエハ及びそれを用いた弾性波装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2845432B2 (ja) * | 1987-09-04 | 1999-01-13 | 株式会社東芝 | 四ホウ酸リチウム単結晶基板の製造方法 |
| JP2587133Y2 (ja) * | 1992-07-23 | 1998-12-14 | ミサワホーム株式会社 | 太陽電池付き屋根パネル |
| US6884972B2 (en) | 1999-12-09 | 2005-04-26 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/inspecting apparatus |
| JP2001332949A (ja) * | 2000-05-19 | 2001-11-30 | Toshiba Corp | 弾性表面波素子の製造方法 |
| JP7439415B2 (ja) * | 2019-08-28 | 2024-02-28 | 住友金属鉱山株式会社 | 圧電性基板、圧電性基板の製造方法、及び複合基板 |
-
1982
- 1982-09-10 JP JP15678982A patent/JPS5947822A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017983A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 弾性波装置用ウエハ及びそれを用いた弾性波装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5947822A (ja) | 1984-03-17 |
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