JPH0218582B2 - - Google Patents

Info

Publication number
JPH0218582B2
JPH0218582B2 JP58055233A JP5523383A JPH0218582B2 JP H0218582 B2 JPH0218582 B2 JP H0218582B2 JP 58055233 A JP58055233 A JP 58055233A JP 5523383 A JP5523383 A JP 5523383A JP H0218582 B2 JPH0218582 B2 JP H0218582B2
Authority
JP
Japan
Prior art keywords
inert gas
wire
ball
bonding tool
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58055233A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59182533A (ja
Inventor
Hiroshi Ushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58055233A priority Critical patent/JPS59182533A/ja
Publication of JPS59182533A publication Critical patent/JPS59182533A/ja
Publication of JPH0218582B2 publication Critical patent/JPH0218582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature

Landscapes

  • Wire Bonding (AREA)
JP58055233A 1983-04-01 1983-04-01 ワイヤボンダ用ツ−ル Granted JPS59182533A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58055233A JPS59182533A (ja) 1983-04-01 1983-04-01 ワイヤボンダ用ツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58055233A JPS59182533A (ja) 1983-04-01 1983-04-01 ワイヤボンダ用ツ−ル

Publications (2)

Publication Number Publication Date
JPS59182533A JPS59182533A (ja) 1984-10-17
JPH0218582B2 true JPH0218582B2 (cg-RX-API-DMAC7.html) 1990-04-26

Family

ID=12992880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58055233A Granted JPS59182533A (ja) 1983-04-01 1983-04-01 ワイヤボンダ用ツ−ル

Country Status (1)

Country Link
JP (1) JPS59182533A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
CN108981374A (zh) * 2018-08-10 2018-12-11 德淮半导体有限公司 晶圆烘干机

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574044U (cg-RX-API-DMAC7.html) * 1978-11-13 1980-05-21

Also Published As

Publication number Publication date
JPS59182533A (ja) 1984-10-17

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