JPH0217954B2 - - Google Patents
Info
- Publication number
- JPH0217954B2 JPH0217954B2 JP10421685A JP10421685A JPH0217954B2 JP H0217954 B2 JPH0217954 B2 JP H0217954B2 JP 10421685 A JP10421685 A JP 10421685A JP 10421685 A JP10421685 A JP 10421685A JP H0217954 B2 JPH0217954 B2 JP H0217954B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- copper foil
- double
- soldering
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 39
- 238000005476 soldering Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000005452 bending Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10421685A JPS61263193A (ja) | 1985-05-16 | 1985-05-16 | 両面印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10421685A JPS61263193A (ja) | 1985-05-16 | 1985-05-16 | 両面印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263193A JPS61263193A (ja) | 1986-11-21 |
| JPH0217954B2 true JPH0217954B2 (de) | 1990-04-24 |
Family
ID=14374762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10421685A Granted JPS61263193A (ja) | 1985-05-16 | 1985-05-16 | 両面印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263193A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439052U (de) * | 1990-07-31 | 1992-04-02 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4967042A (en) * | 1988-12-22 | 1990-10-30 | Texas Instruments Incorporated | System for enhancing current carrying capacity of printed wiring board |
| JP2010165808A (ja) * | 2009-01-15 | 2010-07-29 | Mitsubishi Electric Corp | 電子制御装置 |
-
1985
- 1985-05-16 JP JP10421685A patent/JPS61263193A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0439052U (de) * | 1990-07-31 | 1992-04-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61263193A (ja) | 1986-11-21 |
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