JPH0217864U - - Google Patents
Info
- Publication number
- JPH0217864U JPH0217864U JP9705788U JP9705788U JPH0217864U JP H0217864 U JPH0217864 U JP H0217864U JP 9705788 U JP9705788 U JP 9705788U JP 9705788 U JP9705788 U JP 9705788U JP H0217864 U JPH0217864 U JP H0217864U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- frame
- present
- warpage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１の実施例を示し、図面ａ
はその平面図、同図ｂはａにおける―線断面
図である。第２図は本考案の第２の実施例の平面
図である。第３図は本考案の第３の実施例を示し
、同図ａは平面図、同図ｂはａにおける―線
断面図である。第４図は本考案の第４の実施例を
示し、同図ａは平面図、ｂは作用説明図である。
第５図乃至第７図は従来技術を示す図である。
１，１ａ〜１ｄ…プリント基板、２…枠、３…
材料、Ｐ…パターン。
FIG. 1 shows a first embodiment of the present invention, and FIG.
is a plan view thereof, and b is a sectional view taken along the line a. FIG. 2 is a plan view of a second embodiment of the present invention. FIG. 3 shows a third embodiment of the present invention, in which figure a is a plan view and figure b is a sectional view taken along the line a. FIG. 4 shows a fourth embodiment of the present invention, in which figure a is a plan view and b is a diagram illustrating the operation.
FIGS. 5 to 7 are diagrams showing the prior art. 1, 1a to 1d...Printed circuit board, 2...Frame, 3...
Material, P...pattern.
Claims (1)
け、 該枠にプリント基板の反りを相殺する量の材料
を担持させて構成したプリント基板。 ２ パターンが形成された複数のプリント基板を
枠により支持させたプリント基板集合体であつて
、 表側部分に存在するパターン形成材料を含む材
料と、裏側部分に存在するパターン形成材料を含
む材料とを、互いに反りを相殺する量にしたプリ
ント基板集合体。[Claims for Utility Model Registration] 1. A printed circuit board constructed by providing a frame on a printed circuit board on which a pattern is formed, and supporting the frame with an amount of material that offsets the warpage of the printed circuit board. 2. A printed circuit board assembly in which a plurality of printed circuit boards on which patterns are formed are supported by a frame, in which a material containing a pattern forming material is present on the front side, and a material containing a pattern forming material is present on the back side. , an assembly of printed circuit boards whose quantities cancel out each other's warpage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9705788U JPH0217864U (en) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9705788U JPH0217864U (en) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217864U true JPH0217864U (en) | 1990-02-06 |
Family
ID=31322267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9705788U Pending JPH0217864U (en) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217864U (en) |
-
1988
- 1988-07-22 JP JP9705788U patent/JPH0217864U/ja active Pending