JPH02175894A - スズ、スズ合金電気めっき方法及び同電気めっき装置 - Google Patents

スズ、スズ合金電気めっき方法及び同電気めっき装置

Info

Publication number
JPH02175894A
JPH02175894A JP32920788A JP32920788A JPH02175894A JP H02175894 A JPH02175894 A JP H02175894A JP 32920788 A JP32920788 A JP 32920788A JP 32920788 A JP32920788 A JP 32920788A JP H02175894 A JPH02175894 A JP H02175894A
Authority
JP
Japan
Prior art keywords
tin
anode
plating
alloy
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32920788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0424440B2 (enrdf_load_stackoverflow
Inventor
Keiki Kiyohara
清原 啓喜
Katsuhiro Fukuoka
福岡 万博
Haruo Konishi
小西 陽夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOSAKU KK
Original Assignee
KOSAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOSAKU KK filed Critical KOSAKU KK
Priority to JP32920788A priority Critical patent/JPH02175894A/ja
Publication of JPH02175894A publication Critical patent/JPH02175894A/ja
Publication of JPH0424440B2 publication Critical patent/JPH0424440B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP32920788A 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置 Granted JPH02175894A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32920788A JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32920788A JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Publications (2)

Publication Number Publication Date
JPH02175894A true JPH02175894A (ja) 1990-07-09
JPH0424440B2 JPH0424440B2 (enrdf_load_stackoverflow) 1992-04-27

Family

ID=18218854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32920788A Granted JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Country Status (1)

Country Link
JP (1) JPH02175894A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
JPH06146087A (ja) * 1992-11-12 1994-05-27 Nobuyasu Doi 電気メッキ法
JP2002146599A (ja) * 2000-07-07 2002-05-22 Applied Materials Inc 被覆陽極装置および関連する方法
JP2002521572A (ja) * 1998-07-30 2002-07-16 ヴァルター ヒレブラント ゲーエムベーハー ウント コー. ガルヴァノテヒニーク 亜鉛−ニッケル浴用アルカリ性めっき浴槽
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法
WO2006016603A1 (ja) * 2004-08-10 2006-02-16 Dipsol Chemicals Co., Ltd. 錫-亜鉛合金電気めっき方法
US20100147696A1 (en) * 2007-02-14 2010-06-17 Klaus Bronder Copper-tin electrolyte and method for depositing bronze layers
US20110089043A1 (en) * 2008-05-08 2011-04-21 Umicore Galvanotechnik Gmbh Modified copper-tin electrolyte and process for the deposition of bronze layers
KR101146740B1 (ko) * 2009-11-03 2012-05-17 주식회사 익스톨 주석 도금 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011698A1 (ja) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. 錫−銀−銅含有めっき液及び同めっき被膜並びにそのめっき方法
WO2019089282A1 (en) 2017-11-01 2019-05-09 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
JPH06146087A (ja) * 1992-11-12 1994-05-27 Nobuyasu Doi 電気メッキ法
JP2002521572A (ja) * 1998-07-30 2002-07-16 ヴァルター ヒレブラント ゲーエムベーハー ウント コー. ガルヴァノテヒニーク 亜鉛−ニッケル浴用アルカリ性めっき浴槽
US8486235B2 (en) 1998-07-30 2013-07-16 Ewh Industrieanlagen Gmbh & Co. Kg Alkaline zinc-nickel bath
JP2002146599A (ja) * 2000-07-07 2002-05-22 Applied Materials Inc 被覆陽極装置および関連する方法
JP2005139474A (ja) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd 電気スズ合金メッキ方法
WO2006016603A1 (ja) * 2004-08-10 2006-02-16 Dipsol Chemicals Co., Ltd. 錫-亜鉛合金電気めっき方法
JP2006052431A (ja) * 2004-08-10 2006-02-23 Dipsol Chem Co Ltd 錫−亜鉛合金電気めっき方法
US20100147696A1 (en) * 2007-02-14 2010-06-17 Klaus Bronder Copper-tin electrolyte and method for depositing bronze layers
US8211285B2 (en) * 2007-02-14 2012-07-03 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and method for depositing bronze layers
US20110089043A1 (en) * 2008-05-08 2011-04-21 Umicore Galvanotechnik Gmbh Modified copper-tin electrolyte and process for the deposition of bronze layers
KR101146740B1 (ko) * 2009-11-03 2012-05-17 주식회사 익스톨 주석 도금 장치

Also Published As

Publication number Publication date
JPH0424440B2 (enrdf_load_stackoverflow) 1992-04-27

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