JPH0424440B2 - - Google Patents

Info

Publication number
JPH0424440B2
JPH0424440B2 JP63329207A JP32920788A JPH0424440B2 JP H0424440 B2 JPH0424440 B2 JP H0424440B2 JP 63329207 A JP63329207 A JP 63329207A JP 32920788 A JP32920788 A JP 32920788A JP H0424440 B2 JPH0424440 B2 JP H0424440B2
Authority
JP
Japan
Prior art keywords
tin
anode
electroplating
chamber
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63329207A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02175894A (ja
Inventor
Keiki Kyohara
Katsuhiro Fukuoka
Haruo Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOSAKU KK
Original Assignee
KOSAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOSAKU KK filed Critical KOSAKU KK
Priority to JP32920788A priority Critical patent/JPH02175894A/ja
Publication of JPH02175894A publication Critical patent/JPH02175894A/ja
Publication of JPH0424440B2 publication Critical patent/JPH0424440B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP32920788A 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置 Granted JPH02175894A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32920788A JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32920788A JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Publications (2)

Publication Number Publication Date
JPH02175894A JPH02175894A (ja) 1990-07-09
JPH0424440B2 true JPH0424440B2 (enrdf_load_stackoverflow) 1992-04-27

Family

ID=18218854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32920788A Granted JPH02175894A (ja) 1988-12-28 1988-12-28 スズ、スズ合金電気めっき方法及び同電気めっき装置

Country Status (1)

Country Link
JP (1) JPH02175894A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011698A1 (ja) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. 錫−銀−銅含有めっき液及び同めっき被膜並びにそのめっき方法
US11859300B2 (en) 2017-11-01 2024-01-02 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284691A (ja) * 1991-03-13 1992-10-09 Arumetsukusu:Kk プリント配線板の電気めっき方法
JPH06146087A (ja) * 1992-11-12 1994-05-27 Nobuyasu Doi 電気メッキ法
DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US6576110B2 (en) * 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
JP4594672B2 (ja) * 2004-08-10 2010-12-08 ディップソール株式会社 錫−亜鉛合金電気めっき方法
DE502007002479D1 (de) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE502008001647D1 (de) * 2008-05-08 2010-12-09 Umicore Galvanotechnik Gmbh Modifizierter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
KR101146740B1 (ko) * 2009-11-03 2012-05-17 주식회사 익스톨 주석 도금 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011698A1 (ja) * 2002-07-25 2004-02-05 Shinryo Electronics Co., Ltd. 錫−銀−銅含有めっき液及び同めっき被膜並びにそのめっき方法
US11859300B2 (en) 2017-11-01 2024-01-02 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus
US12392049B2 (en) 2017-11-01 2025-08-19 Lam Research Corporation Controlling plating electrolyte concentration on an electrochemical plating apparatus

Also Published As

Publication number Publication date
JPH02175894A (ja) 1990-07-09

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