JPH021634B2 - - Google Patents
Info
- Publication number
- JPH021634B2 JPH021634B2 JP56020585A JP2058581A JPH021634B2 JP H021634 B2 JPH021634 B2 JP H021634B2 JP 56020585 A JP56020585 A JP 56020585A JP 2058581 A JP2058581 A JP 2058581A JP H021634 B2 JPH021634 B2 JP H021634B2
- Authority
- JP
- Japan
- Prior art keywords
- suction tool
- claws
- chip
- position regulating
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56020585A JPS57138587A (en) | 1981-02-13 | 1981-02-13 | Shifter for article |
| US06/348,404 US4473247A (en) | 1981-02-13 | 1982-02-12 | Component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56020585A JPS57138587A (en) | 1981-02-13 | 1981-02-13 | Shifter for article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57138587A JPS57138587A (en) | 1982-08-26 |
| JPH021634B2 true JPH021634B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-12 |
Family
ID=12031298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56020585A Granted JPS57138587A (en) | 1981-02-13 | 1981-02-13 | Shifter for article |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4473247A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JPS57138587A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5988289A (ja) * | 1982-11-10 | 1984-05-22 | 株式会社フジキカイ | 産業用ロボツトのハンド |
| JPS59130882U (ja) * | 1983-02-21 | 1984-09-03 | 新日本製鐵株式会社 | 円筒体把持装置 |
| JPS59224279A (ja) * | 1983-06-01 | 1984-12-17 | 富士機械製造株式会社 | 電子部品の位置決め保持方法および装置 |
| WO1985003405A1 (en) * | 1984-01-23 | 1985-08-01 | Dyna/Pert - Precima Limited | Pick-up head for handling electrical components |
| JPS61501116A (ja) * | 1984-01-23 | 1986-05-29 | ダイナパ−ト プレシマ リミテツド | 電子部品を取扱うためのピックアップヘッド |
| GB8406129D0 (en) * | 1984-03-08 | 1984-04-11 | Dyna Pert Precima Ltd | Orienting electrical components |
| US4789292A (en) * | 1984-04-06 | 1988-12-06 | Holcomb Gregory W | End effector for robotic equipment |
| US4599037A (en) * | 1984-07-02 | 1986-07-08 | United Technologies Corporation | Method and apparatus for manipulating miniature parts |
| DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
| US4593462A (en) * | 1984-09-24 | 1986-06-10 | Tdk Corporation | Apparatus for automatically mounting chip-type circuit elements on substrate |
| US4611397A (en) * | 1984-10-09 | 1986-09-16 | Universal Instruments Corporation | Pick and place method and apparatus for handling electrical components |
| CA1246121A (en) * | 1984-11-15 | 1988-12-06 | Westinghouse Electric Corporation | Robotic end effector |
| US4657470A (en) * | 1984-11-15 | 1987-04-14 | Westinghouse Electric Corp. | Robotic end effector |
| US4769904A (en) * | 1985-08-02 | 1988-09-13 | Universal Instruments Corporation | Method and apparatus for handling leaded and leadless surface mountable components |
| US4802816A (en) * | 1985-10-08 | 1989-02-07 | Excellon Industries | Pick and place machine having improved centering jaws |
| JPH0357436Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1985-11-05 | 1991-12-27 | ||
| US4741567A (en) * | 1987-01-12 | 1988-05-03 | Rca Corporation | Robotic system and end effector |
| JPH0691355B2 (ja) * | 1988-01-19 | 1994-11-14 | 三洋電機株式会社 | 電子部品位置決め装置 |
| US4858974A (en) * | 1988-05-02 | 1989-08-22 | Stannek Karl H | Robotic gripper head |
| JP2617530B2 (ja) * | 1988-09-02 | 1997-06-04 | 学校法人早稲田大学 | 球根りん片植付ハンド |
| US5018937A (en) * | 1988-10-05 | 1991-05-28 | Grumman Aerospace Corporation | Shearclip-handling tool |
| US4950011A (en) * | 1988-10-24 | 1990-08-21 | Nicky Borcea | Tool for precisely positioning a workpiece |
| US5056844A (en) * | 1990-03-06 | 1991-10-15 | Amistar Corporation | Multiple jaw centering head structure for surface mounted component placement machines |
| JP2566042B2 (ja) * | 1990-05-21 | 1996-12-25 | 株式会社東芝 | 光半導体製造装置 |
| JP2641020B2 (ja) * | 1993-07-13 | 1997-08-13 | 株式会社しなのエレクトロニクス | 吸着挟持機構及びそれを用いた温度試験装置 |
| US5449265A (en) * | 1994-02-15 | 1995-09-12 | Zierick Manufacturing Corporation | Feeder and method of supplying a continuous strip of surface mount contacts to pick-and-place machine |
| US5605430A (en) * | 1994-02-15 | 1997-02-25 | Zierick Manufacturing Corporation | Feeder and method of supplying a continuous strip of surface mount contacts to surface mounting equipment |
| US5572785A (en) * | 1994-07-27 | 1996-11-12 | Eastman Kodak Company | Apparatus and method for automated assembly of precision components |
| US5697658A (en) * | 1995-05-05 | 1997-12-16 | Samsung Electronics Co., Ltd. | Centering apparatus for component mounting device |
| US6045321A (en) * | 1998-03-23 | 2000-04-04 | Lucent Technologies, Inc. | Method and apparatus for transporting laser bars |
| US6139078A (en) * | 1998-11-13 | 2000-10-31 | International Business Machines Corporation | Self-aligning end effector for small components |
| JP2007157996A (ja) * | 2005-12-05 | 2007-06-21 | Tokyo Seimitsu Co Ltd | ワーク搬送装置及びワーク搬送方法 |
| CN100427369C (zh) * | 2005-12-26 | 2008-10-22 | 哈尔滨工业大学 | 负压式靶丸拾取器 |
| US8070409B2 (en) * | 2007-11-05 | 2011-12-06 | Ajax Tocco Magnethermic Corp. | Method and apparatus for transporting steel billets |
| KR101610272B1 (ko) * | 2009-04-15 | 2016-04-08 | 한화테크윈 주식회사 | 진공 노즐 제어 장치 및 이를 갖는 부품 실장기용 헤드 어셈블리 |
| JP6459326B2 (ja) * | 2014-09-10 | 2019-01-30 | 富士ゼロックス株式会社 | 保持具、搭載装置、搭載方法、基板装置の製造方法 |
| ES2948462T3 (es) | 2015-08-26 | 2023-09-12 | Berkshire Grey Operating Company Inc | Sistemas y métodos para proporcionar detección de contacto en un brazo articulado |
| CN108472814B (zh) | 2016-01-08 | 2021-07-16 | 伯克希尔格雷股份有限公司 | 用于获取并移动物体的系统和方法 |
| ITUB20160018A1 (it) * | 2016-01-25 | 2017-07-25 | Officina Meccanica Di Prec G 3 Di Gamba Walter & C S N C | Picker per manipolatore di circuiti integrati |
| US10493638B1 (en) * | 2018-09-11 | 2019-12-03 | Jabil Inc. | Apparatus, system and method for providing a vacuum ejector for an end effector |
| US10099387B2 (en) * | 2017-01-24 | 2018-10-16 | Jabil Inc. | Apparatus, system and method for providing a vacuum ejector for an end effector |
| US11511443B2 (en) * | 2020-02-10 | 2022-11-29 | The Boeing Company | Method and apparatus for drilling a workpiece |
| WO2022020159A1 (en) | 2020-07-22 | 2022-01-27 | Berkshire Grey, Inc. | Systems and methods for object processing using a passively collapsing vacuum gripper |
| US12070851B2 (en) | 2020-07-22 | 2024-08-27 | Berkshire Grey Operating Company, Inc. | Systems and methods for object processing using a vacuum gripper that provides object retention by evacuation |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2665603A (en) * | 1950-01-20 | 1954-01-12 | Hydropress Inc | Testing machine clamping device |
| US3651957A (en) * | 1970-03-02 | 1972-03-28 | Motorola Inc | Chip packaging and transporting apparatus |
| JPS5325368A (en) * | 1976-08-23 | 1978-03-09 | Hitachi Ltd | Pellet attaching collet |
| US4135630A (en) * | 1977-12-08 | 1979-01-23 | Universal Instruments Corporation | Centering device for automatic placement of chip components in hybrid circuits |
| JPS5537283A (en) * | 1978-09-08 | 1980-03-15 | Matsushita Electric Industrial Co Ltd | Article shifter |
| JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Industrial Co Ltd | Device for mounting electronic part |
| JPS55118690A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Industrial Co Ltd | Device for carrying electronic part |
| US4340211A (en) * | 1979-03-09 | 1982-07-20 | Pietro Chiappetti | Adjustable vee block clamp |
-
1981
- 1981-02-13 JP JP56020585A patent/JPS57138587A/ja active Granted
-
1982
- 1982-02-12 US US06/348,404 patent/US4473247A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57138587A (en) | 1982-08-26 |
| US4473247A (en) | 1984-09-25 |