JPH02148745A - リードフレーム位置決め装置 - Google Patents

リードフレーム位置決め装置

Info

Publication number
JPH02148745A
JPH02148745A JP30172388A JP30172388A JPH02148745A JP H02148745 A JPH02148745 A JP H02148745A JP 30172388 A JP30172388 A JP 30172388A JP 30172388 A JP30172388 A JP 30172388A JP H02148745 A JPH02148745 A JP H02148745A
Authority
JP
Japan
Prior art keywords
lead frame
cutting
punch
resin
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30172388A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514421B2 (cg-RX-API-DMAC7.html
Inventor
Shoichiro Iwabuchi
岩渕　昭一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP30172388A priority Critical patent/JPH02148745A/ja
Publication of JPH02148745A publication Critical patent/JPH02148745A/ja
Publication of JPH0514421B2 publication Critical patent/JPH0514421B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP30172388A 1988-11-29 1988-11-29 リードフレーム位置決め装置 Granted JPH02148745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30172388A JPH02148745A (ja) 1988-11-29 1988-11-29 リードフレーム位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30172388A JPH02148745A (ja) 1988-11-29 1988-11-29 リードフレーム位置決め装置

Publications (2)

Publication Number Publication Date
JPH02148745A true JPH02148745A (ja) 1990-06-07
JPH0514421B2 JPH0514421B2 (cg-RX-API-DMAC7.html) 1993-02-25

Family

ID=17900387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30172388A Granted JPH02148745A (ja) 1988-11-29 1988-11-29 リードフレーム位置決め装置

Country Status (1)

Country Link
JP (1) JPH02148745A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102350457A (zh) * 2011-08-25 2012-02-15 铜陵三佳山田科技有限公司 分立器件产品冲切模具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094732A (ja) * 1983-10-27 1985-05-27 Mitsubishi Electric Corp 半導体装置の製造装置
JPS619299U (ja) * 1984-06-19 1986-01-20 日本電気株式会社 ダイバ切断型用ポンチ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094732A (ja) * 1983-10-27 1985-05-27 Mitsubishi Electric Corp 半導体装置の製造装置
JPS619299U (ja) * 1984-06-19 1986-01-20 日本電気株式会社 ダイバ切断型用ポンチ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102350457A (zh) * 2011-08-25 2012-02-15 铜陵三佳山田科技有限公司 分立器件产品冲切模具

Also Published As

Publication number Publication date
JPH0514421B2 (cg-RX-API-DMAC7.html) 1993-02-25

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