JPH0214778B2 - - Google Patents

Info

Publication number
JPH0214778B2
JPH0214778B2 JP58092834A JP9283483A JPH0214778B2 JP H0214778 B2 JPH0214778 B2 JP H0214778B2 JP 58092834 A JP58092834 A JP 58092834A JP 9283483 A JP9283483 A JP 9283483A JP H0214778 B2 JPH0214778 B2 JP H0214778B2
Authority
JP
Japan
Prior art keywords
film
aluminum
grown
layer
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58092834A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59218760A (ja
Inventor
Taiichi Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58092834A priority Critical patent/JPS59218760A/ja
Publication of JPS59218760A publication Critical patent/JPS59218760A/ja
Publication of JPH0214778B2 publication Critical patent/JPH0214778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H10W72/07551—
    • H10W72/07553—
    • H10W72/50—
    • H10W72/531—
    • H10W72/536—
    • H10W72/59—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Wire Bonding (AREA)
JP58092834A 1983-05-26 1983-05-26 半導体装置 Granted JPS59218760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58092834A JPS59218760A (ja) 1983-05-26 1983-05-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58092834A JPS59218760A (ja) 1983-05-26 1983-05-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS59218760A JPS59218760A (ja) 1984-12-10
JPH0214778B2 true JPH0214778B2 (enExample) 1990-04-10

Family

ID=14065453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58092834A Granted JPS59218760A (ja) 1983-05-26 1983-05-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS59218760A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194931A (en) * 1989-06-13 1993-03-16 Kabushiki Kaisha Toshiba Master slice semiconductor device

Also Published As

Publication number Publication date
JPS59218760A (ja) 1984-12-10

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