JPH02146449U - - Google Patents
Info
- Publication number
- JPH02146449U JPH02146449U JP1989056577U JP5657789U JPH02146449U JP H02146449 U JPH02146449 U JP H02146449U JP 1989056577 U JP1989056577 U JP 1989056577U JP 5657789 U JP5657789 U JP 5657789U JP H02146449 U JPH02146449 U JP H02146449U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- sealed semiconductor
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
-
- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056577U JPH02146449U (enExample) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056577U JPH02146449U (enExample) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146449U true JPH02146449U (enExample) | 1990-12-12 |
Family
ID=31580530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989056577U Pending JPH02146449U (enExample) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146449U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322747B2 (enExample) * | 1982-06-24 | 1988-05-13 | Fujitsu Ltd |
-
1989
- 1989-05-16 JP JP1989056577U patent/JPH02146449U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6322747B2 (enExample) * | 1982-06-24 | 1988-05-13 | Fujitsu Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |