JPS6165757U - - Google Patents
Info
- Publication number
- JPS6165757U JPS6165757U JP1984150249U JP15024984U JPS6165757U JP S6165757 U JPS6165757 U JP S6165757U JP 1984150249 U JP1984150249 U JP 1984150249U JP 15024984 U JP15024984 U JP 15024984U JP S6165757 U JPS6165757 U JP S6165757U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- coating layer
- alloy
- copper
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150249U JPS6165757U (enExample) | 1984-10-05 | 1984-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150249U JPS6165757U (enExample) | 1984-10-05 | 1984-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6165757U true JPS6165757U (enExample) | 1986-05-06 |
Family
ID=30708402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984150249U Pending JPS6165757U (enExample) | 1984-10-05 | 1984-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165757U (enExample) |
-
1984
- 1984-10-05 JP JP1984150249U patent/JPS6165757U/ja active Pending