JPS63114027U - - Google Patents
Info
- Publication number
- JPS63114027U JPS63114027U JP1987006113U JP611387U JPS63114027U JP S63114027 U JPS63114027 U JP S63114027U JP 1987006113 U JP1987006113 U JP 1987006113U JP 611387 U JP611387 U JP 611387U JP S63114027 U JPS63114027 U JP S63114027U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- brazing material
- exposed portion
- wettability
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/387—
-
- H10W72/5449—
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- H10W72/884—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987006113U JPS63114027U (enExample) | 1987-01-20 | 1987-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987006113U JPS63114027U (enExample) | 1987-01-20 | 1987-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114027U true JPS63114027U (enExample) | 1988-07-22 |
Family
ID=30788323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987006113U Pending JPS63114027U (enExample) | 1987-01-20 | 1987-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114027U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010067755A (ja) * | 2008-09-10 | 2010-03-25 | Renesas Technology Corp | 半導体装置 |
| JP2016058612A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社デンソー | 半導体装置 |
-
1987
- 1987-01-20 JP JP1987006113U patent/JPS63114027U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010067755A (ja) * | 2008-09-10 | 2010-03-25 | Renesas Technology Corp | 半導体装置 |
| JP2016058612A (ja) * | 2014-09-11 | 2016-04-21 | 株式会社デンソー | 半導体装置 |