JPH0213935B2 - - Google Patents

Info

Publication number
JPH0213935B2
JPH0213935B2 JP13330283A JP13330283A JPH0213935B2 JP H0213935 B2 JPH0213935 B2 JP H0213935B2 JP 13330283 A JP13330283 A JP 13330283A JP 13330283 A JP13330283 A JP 13330283A JP H0213935 B2 JPH0213935 B2 JP H0213935B2
Authority
JP
Japan
Prior art keywords
lead
bonding
hole
tape
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13330283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6025263A (ja
Inventor
Kazufumi Terachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP13330283A priority Critical patent/JPS6025263A/ja
Publication of JPS6025263A publication Critical patent/JPS6025263A/ja
Publication of JPH0213935B2 publication Critical patent/JPH0213935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP13330283A 1983-07-21 1983-07-21 リ−ドフレ−ム Granted JPS6025263A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13330283A JPS6025263A (ja) 1983-07-21 1983-07-21 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13330283A JPS6025263A (ja) 1983-07-21 1983-07-21 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6025263A JPS6025263A (ja) 1985-02-08
JPH0213935B2 true JPH0213935B2 (US07923587-20110412-C00001.png) 1990-04-05

Family

ID=15101482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13330283A Granted JPS6025263A (ja) 1983-07-21 1983-07-21 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS6025263A (US07923587-20110412-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129848U (US07923587-20110412-C00001.png) * 1990-04-10 1991-12-26

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899207A (en) * 1986-08-27 1990-02-06 Digital Equipment Corporation Outer lead tape automated bonding
JP2559902B2 (ja) * 1990-11-14 1996-12-04 大江化学工業株式会社 ヒートシール性通気包装材料の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03129848U (US07923587-20110412-C00001.png) * 1990-04-10 1991-12-26

Also Published As

Publication number Publication date
JPS6025263A (ja) 1985-02-08

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