JPH021392B2 - - Google Patents
Info
- Publication number
- JPH021392B2 JPH021392B2 JP6800384A JP6800384A JPH021392B2 JP H021392 B2 JPH021392 B2 JP H021392B2 JP 6800384 A JP6800384 A JP 6800384A JP 6800384 A JP6800384 A JP 6800384A JP H021392 B2 JPH021392 B2 JP H021392B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- layer
- etching resist
- inner layer
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000011888 foil Substances 0.000 description 13
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229960003280 cupric chloride Drugs 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6800384A JPS60211896A (ja) | 1984-04-05 | 1984-04-05 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6800384A JPS60211896A (ja) | 1984-04-05 | 1984-04-05 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60211896A JPS60211896A (ja) | 1985-10-24 |
| JPH021392B2 true JPH021392B2 (de) | 1990-01-11 |
Family
ID=13361259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6800384A Granted JPS60211896A (ja) | 1984-04-05 | 1984-04-05 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211896A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100209259B1 (ko) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic 카드 및 그 제조방법 |
-
1984
- 1984-04-05 JP JP6800384A patent/JPS60211896A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60211896A (ja) | 1985-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |